SCEJ

$B2=3X9)3X2q(B $BBh(B39$B2s=)5(Bg2q(B

$B9V1i%W%m%0%i%`!J%;%C%7%g%sJL!K(B

$B%7%s%]%8%&%`(B $B!c

Z206-Z209, Z213-Z221

$B:G=*99?7F|;~!'(B2007-07-24 09:36:53
$B9V1i(B
$B;~9o(B		$B9V1i(B
$BHV9f(B		$B9V1iBjL\!?H/I=$B%-!<%o!<%I(B$BJ,N`(B
$BHV9f(B		$B$BHV9f(B
Z$B2q>l(B $BBh(B2$BF|(B
(10:40$B!A(B12:00)$B!!(B($B:BD9(B $B2,K\>0fLw(B)
10:40$B!A(B 11:00Z206$B%l!<%6!
($BElKLBg1!9)(B) $B!{(B($B3X(B)$B@6?e(B $BD>$B!&(B($B@5(B)$BD9Hx(B $BBgJe(B$B!&(B($B@5(B)$B>.NS(B $BK'CK(B$B!&(B($B@5(B)$B:#Ln(B $B44CK(B$B!&(B$BEOJU(B $BL@(B		Micropatterning
Laser-induced pyrolysis
Dielectric thin film
S-13263
11:00$B!A(B 11:20Z207$B%>%k!>%2%kK!$K$h$k9bM6EE@-GvKl$N?75,Dc299g@.K!$N3+H/(B
($BElKLBg1!9)(B) $B!{(B($B3X(B)$Bc7F#(B $BGnJ8(B$B!&(B($B@5(B)$BD9Hx(B $BBgJe(B$B!&(B($B@5(B)$B:#Ln(B $B44CK(B		Dielectric thin film
Low temperature synthesis
Barium titanate
S-13446
11:20$B!A(B 12:00Z208$B%$%*%s%^%$%0%l!<%7%g%s$K$h$kG[@~4VC;Mm(B
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B		ion migration
diffusion of ion
short circuit
S-132
(13:00$B!A(B14:20)$B!!(B($B:BD9(B $B2.LnJ84](BE$BCfB<1QGn(B)
13:00$B!A(B 13:40Z213[$BE8K>9V1i(B]$BEE5$F<$a$C$-$NKl8|6Q0l@-$H%U%#%j%s%0@-$N8~>e(B
($BFLHG0u:~Am8&(B) $B!{(B($BIt(B)$BBg5WJ](B $BMx0l(B		copper electroplating
thickness uniformity
filling performance
S-13109
13:40$B!A(B 14:00Z215PR$BEE2r$rMQ$$$?7jKd$a$a$C$-(B
($B:eI\Bg9)(B) $B!{(B($B3X(B)$BJ!ED(B $BNI(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electroplating
copper damascene
rotating electrode
S-1354
14:00$B!A(B 14:20Z216$B<+8JAH?%2=C1J,;RKl%l%8%9%H$rMQ$$$kF<4pHD$N%1%_%+%k%(%C%A%s%0(B
($B1'ET5\Bg1!9)(B) $B!{(B($B@5(B)$B:4F#(B $B@5=((B$B!&(B($B3X(B)$B9b66(B $BH~:i(B$B!&(B($B1'ET5\Bg9)(B) ($B@5(B)$B8E_7(B $B5#(B$B!&(B($B1'ET5\Bg1!9)(B) ($B@5(B)$BNkLZ(B $B>:(B		Self-assembled monolayer
etch resist
copper substrate
S-131035
(14:20$B!A(B16:00)$B!!(B($B:BD9(B $B:#Ln44CK(BE$BBg5WJ]Mx0l(B)
14:20$B!A(B 14:40Z217Cu$B$a$C$-Kl$h$jH/@8$9$k%N%8%e!<%k$N@O=P5!9=$N8!F$(B
($B:eI\Bg9)(B) $B!{(B($B3X(B)$B9b66(B $BAo(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electroplating
copper
nodule
S-1344
14:40$B!A(B 15:00Z218$B1U>=%]%j%^!<$rMQ$$$?%P%s%WFbB"4pHD$K$h$k0l3g@QAX$N4pAC8!F$(B
($BF|N)2=@.9)6H(B) $B!{(B($B@5(B)$BCfB<(B $B1QGn(B		Concurrent Multi-layering
Embedded Bump Substrate
Liquid Crystal Polymer
S-1316
15:00$B!A(B 15:20Z219$B9b%"%9%Z%/%H9&$X$N$a$C$-(B
($B:eI\Bg9)(B) $B!{(B($B3X(B)$BNkLZ(B $BM5;N(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electrodeposition
copper
higher aspect ratio
S-1355
15:20$B!A(B 15:40Z220$BJ?3jF
($B;00f6bB0(B) $B!{(B($B@5(B)$B>>Eg(B $BIRJ8(B$B!&(B$B>>1J(B $BE/9-(B$B!&(B$B:4F#(B $BE/O/(B		copper foil
profile-free
printed wiring board
S-13438
15:40$B!A(B 16:00Z221$B9b@-G=%]%j%^!<8wF3GHO)$+$i$J$k8wEE5$J#9gG[@~4pHD(B
($B=;M'%Y!<%/%i%$%H(B) $B!{(B($B@5(B)$BD9LZ(B $B9@;J(B$B!&(B$B5\Hx(B $B7{<#(B$B!&(B$B9bIM(B $B7$B!&(B$B?9(B $BE/Li(B$B!&(B$B>>;3(B $BKS9((B$B!&(B$BF#86(B $B@?(B$B!&(B$BEOJU(B $B7<(B$B!&(B$BHxD%(B $BMN;K(B$B!&(B$BGrEZ(B $BMN$B!&(B$B;{ED(B $B?.2p(B		Polymer waveguide
OE hybrid circuit
Surface mount technology
S-1382
$B9V1i%W%m%0%i%`(B
$B2=3X9)3X2q(B $BBh(B39$B2s=)5(Bg2q(B
(C) 2007 ($B
Most recent update: 2007-07-24 09:36:53
For more information contact $B2=3X9)3X2qKL3$F;;YIt(B $BBh(B39$B2s=)5(Bg2q(B $BLd$$9g$;78(B
E-mail: inquiry-39fwww2.scej.org
This page was generated by easp 2.23; proghtml 2.23c (C)1999-2007 kawase