SCEJ

$B2=3X9)3X2q(B $BBh(B41$B2s=)5(Bg2q(B

$B9V1i%W%m%0%i%`!J%;%C%7%g%sJL!K(B

$B%7%s%]%8%&%`(B $B!c%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9!d(B

H213-H218, H301-H323

$B:G=*99?7F|;~!'(B2009-09-07 16:36:42
$B9V1i(B
$B;~9o(B		$B9V1i(B
$BHV9f(B		$B9V1iBjL\!?H/I=$B%-!<%o!<%I(B$BJ,N`(B
$BHV9f(B		$B$BHV9f(B
H$B2q>l(B $BBh(B2$BF|(B
(13:00$B!A(B15:00)$B!!(B($B:BD9(B $B@P0f!!@5?M!&O7ED!!>05W(B)
13:00$B!A(B 13:20H213$B6dG[@~!"F
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B		ion migration
short circuit
Ag, Cu wiring
S-5508
13:20$B!A(B 13:40H214$BM-5!4pHD$rMQ$$$?HyNL%$%*%s%;%s%7%s%0$K4X$9$k4pAC8!F$(B
($BF|N)2=@.9)6H(B) $B!{(B($B@5(B)$BCfB<(B $B1QGn(B		self-assembling monolayer
sensor
reproducibility
S-5447
13:40$B!A(B 14:00H215$B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0K!$rMQ$$$?(BCu$B%7!<%IKl$N:n@=$HI>2A(B
($B?7L@OB(B) $B!{(B($BIt(B)$B4]Cf(B $B@5M:(B$B!&(B$BEZ20(B $B5.G7(B$B!&(B($B:eI\Bg1!9)(B) ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B		Cu Seed
Electoro-Migration
Through Silicon Via
S-543
14:00$B!A(B 14:20H216Si$B4SDLEE6K(B(TSV)$B$N9bB.(BCu$B$a$C$-(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B$BNkLZ(B $BM5;N(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B?7L@OB(B) ($BIt(B)$B4]Cf(B $B@5M:(B$B!&(B$BEZ20(B $B5.G7(B		Copper
TSV
Electrodeposition
S-542
14:20$B!A(B 14:40H217$B%U%#%k%I%S%"$a$C$-$K$*$1$k%8%"%j%k%"%_%s7OE:2C:^$N8z2L(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5WMx(B $B1QG7(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($BF|ElKB(B) $BJ820(B $B>!(B$B!&(B$BC]Fb(B $B		Copper
Electrodeposition
Via-filling
S-5365
14:40$B!A(B 15:00H218$B9b%"%9%Z%/%HHf%-%c%S%F%#Fb$NN.F02r@O(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B>.;3(B $B5AB'(B$B!&(B$BNkLZ(B $BM5;N(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		high aspect ratio
bump
numerical analysis
S-5671
H$B2q>l(B $BBh(B3$BF|(B
(9:00$B!A(B10:40)$B!!(B($B:BD9(B $BCfB
9:00$B!A(B 9:20H301$B%"%b%N%5!<%^%kK!$K$h$k(BGaN$BC17k>=0i@.$K$*$1$k6bB0?(G^$N8!F$(B
($BElKLBgB?858&(B) $B!{(B($B3X(B)$B7*NS(B $B3Y?M(B$B!&(B($B3X(B)$B@PFi(B $BN49,(B$B!&(B$B6@C+(B $BM&Fs(B$B!&(B($B@5(B)$BIZED(B $BBgJe(B$B!&(B$B@P9u(B $BE0(B$B!&(B($B@5(B)$B2#;3(B $B@i><(B		crystal growth
gallium nitride
supercritical ammonia
S-5552
9:20$B!A(B 9:40H302$B%"%b%N%5!<%^%kK!$K$h$k(BGaN$BC17k>=0i@.$K$*$$$F0i@.29EY!&05NO$,M?$($k1F6A(B
($BElKLBgB?858&(B) $B!{(B($B3X(B)$B@PFi(B $BN49,(B$B!&(B($B3X(B)$B7*NS(B $B3Y?M(B$B!&(B$B6@C+(B $BM&Fs(B$B!&(B($B@5(B)$BIZED(B $BBgJe(B$B!&(B$B@P9u(B $BE0(B$B!&(B($B@5(B)$B2#;3(B $B@i><(B		crystal growth
gallium nitride
supercritical ammonia
S-5565
9:40$B!A(B 10:00H303$B1v2=?eAG%,%9$K$h$k;@2=%O%U%K%&%`%(%C%A%s%0(B
($B2#9qBg1!9)(B) $B!{(B($B@5(B)$B1)?<(B $BEy(B$B!&(B($B2#9qBg9)(B) $B;3CO(B $B@5I'(B$B!&(B$B>.KY(B $B2E;L(B$B!&(B($BF|N)9q:]EE5$(B) $BKY0f(B $BDg5A(B$B!&(B$B9q0f(B $BBYIW(B		HfO2
hi-k
S-534
10:00$B!A(B 10:40H304[$B>7BT9V1i(B]$B!!(BMEMS$BF08~(B
($B6eBg(B) $B!{_7ED(B $BNw;N(B		MEMS
Life
Packaging
S-545
(10:40$B!A(B12:00)$B!!(B($B:BD9(B $B1)?
10:40$B!A(B 11:00H306$B;@2=J*%J%N7k>=$N?eG.9g@.$H$=$NBO@Q$K$h$kEE3&8z2L%H%i%s%8%9%?$N7A@.(B
($BElKLBgB?858&(B) $B!{(B($B@5(B)$B9b8+(B $B@?0l(B$B!&(B(NIMS) $BAa@n(B $BN5GO(B$B!&(B$B$B!&(B$BCN5~(B $BK-M5(B$B!&(B($BElKLBg(BWPI) ($B@5(B)$BKL[j(B $BBg2p(B$B!&(B($B@5(B)$BFn(B $B8xN4(B$B!&(B($BElKLBgB?858&(B) ($B@5(B)$BM-ED(B $BL-I'(B$B!&(B($BElKLBg(BWPI) ($B@5(B)$B0$?,(B $B2mJ8(B		metal oxide nanocrystal
drop cast
field-effect transistor
S-5791
11:00$B!A(B 11:20H307ZnS$B4pHD$KBP$9$k%9%k!<%[!<%k%U%#%j%s%0$a$C$-(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$B2,K\(B $B>0$B!&(B($B:eI\Bg9)(B) $B5\K\(B $B$a$0$_(B$B!&(B($B:eI\Bg1!9)(B) ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($BF|;:<+F0$B!&(B$BW"ED(B $B@5		ZnS
deposition
Cu
S-5429
11:20$B!A(B 12:00H308[$B>7BT9V1i(B]$BEE;R%Z!<%Q!u67(B
($B%V%j%B%9%H%s(B) $B!{ED>B(B $B0oIW(B		Electronics
Paper
Packaging
S-5444

(13:00$B!A(B15:00)$B!!(B($B:BD9(B $B9b8+!!@?0l!&snF#!!>f{J(B)
13:00$B!A(B 13:40H313[$B>7BT9V1i(B]$B!!M-5!%(%l%/%H%m%K%/%9!&%U%)%H%K%/%9$N:G6a$NE83+(B
($B;:Am8&(B) $B!{H,@%(B $B@6;V(B		Organic
Device
Printing
S-548
13:40$B!A(B 14:00H315$B%>%k%2%kK!$K$h$k;@2=0!1tF)L@F3EEKl$ND4@=(B
($BElM}Bg9)(B) $B!{(B($B3X(B)$B0KF#(B $B=S>0(B$B!&(B($B@5(B)$BBgC](B $B>!?M(B$B!&(B($B@5(B)$B>1Ln(B $B8|(B$B!&(B($B@5(B)$B9b66(B $BCR51(B$B!&(B$B:#Ln(B $B5*FsO:(B		zinc oxide
sol-gel method
thin films
S-5650
14:00$B!A(B 14:20H316ITO$B%J%NN3;R$rMQ$$$?%[%C%H%W%l%9K!$K$h$kF)L@F3EEKl(B
($B9-Bg1!9)(B) $B!{(B($B3X(B)$B1|B<(B $BOBKa(B$B!&(B($B@5(B)$BLp?a(B $B>49-(B		indium tin oxide
hot-press
nanoparticles
S-5152
14:20$B!A(B 14:40H317$BF<%J%NN3;R$rMQ$$$?F3EEKl(B
($B9-Bg1!9)(B) $B!{(B($B3X(B)Arriffin N.$B!&(B($B@5(B)$BLp?a(B $B>49-(B		Copper nanoparticles
Conductive film
Inkjet
S-5153
14:40$B!A(B 15:00H318$B%$%a!<%8%;%s%5!
($B=;M'%Y!<%/%i%$%H(B) $B!{9b66(B $BK-@?(B$B!&(B$B@nED(B $B@/OB(B		Adhesive
Photodefinable
Wafer level pakage
S-5646
(15:00$B!A(B16:40)$B!!(B($B:BD9(B $B2,K\!!>049-(B)
15:00$B!A(B 15:40H319[$B>7BT9V1i(B] LED$B<~JU5;=Q$N:G?75;=QF08~$H>-MhE8K>(B
($B;38}Bg(B) $B!{ED8}(B $B>o@5(B		LED
Electronics
Packaging
S-5302
15:40$B!A(B 16:00H321$BEE2rF
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$B2,K\(B $B>0$B!&(B$B9b66(B $BAo(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		Cu
electrodeposition
nodule
S-5119
16:00$B!A(B 16:20H322$BHy>.7A>u$X$N(BNi$B$a$C$-Kl$N:n@=$H7A>u@)8f(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B0BBp(B $B0lBY(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electrodeposition
nickel
pattern
S-5642
16:20$B!A(B 16:40H323FeCoNi$B;0859g6b$K$h$kHy>.9=B$J*$N:n@=$HAH@.@)8f(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B;3ED(B $B2m;N(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electrodeposition
alloy
pattern
S-5818
$B9V1i%W%m%0%i%`(B
$B2=3X9)3X2q(B $BBh(B41$B2s=)5(Bg2q(B
(C) 2009 ($B
Most recent update: 2009-09-07 16:36:42
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