SCEJ

$B2=3X9)3X2q(B $BBh(B42$B2s=)5(Bg2q(B

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$B%*!<%,%J%$%6!<(B $B6aF#OBIW(B($BBg:eI\Bg(B)$B!$O7ED>05W(B($B=;M'%Y!<%/%i%$%H(B)$B!$@P0f@5?M(B($B%a%C%/(B), $BsnF#>fLw(B($BBg:eI\Bg(B)

$B%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9$K4X$9$k$9$Y$F$N8&5f$K4X$7$F!"8&5fH/I=$r8xJg$7$^$9!#FC$KH>F3BN:`NA!"%Q%C%1!<%8:`NA!"

$B:G=*99?7F|;~!'(B2010-06-21 20:19:01

$B$3$NJ,N`$G$h$/;H$o$l(B
$B$F$$$k%-!<%o!<%I(B		$B%-!<%o!<%I(B$B
electrodeposition5$B7o(B*
copper3$B7o(B*
TSV2$B7o(B
underfill1$B7o(B

$B$BHV9f(B$B9V1iBjL\!?H/I=$B%-!<%o!<%I(B$B
9Si$B4SDLEE6K(B(TSV)$B$N(BCu$B%7!<%IKl$N:n@=$HI>2A(B
($B?7L@OB9)6H(B($B5;(B)) $B!{(B($BIt(B)$B4]Cf(B $B@5M:(B$B!&(B($BIt(B)$BEZ20(B $B5.G7(B$B!&(B($B:eI\Bg1!9)(B) ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($B@5(B)$BsnF#(B $B>fLw(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B3X(B)$BNS(B $BB@O:(B		Sputter-Ion-Plating
Cu Seed
TSV
4/12
10:46:48
22[$B>7BT9V1i(B]$B
($B;:Am8&(B) $B!{6-(B $BE/CK(B		Battery
Next Generation
4/14
11:10:46
23[$B>7BT9V1i(B]$B%W%j%s%F%C%I%(%l%/%H%m%K%/%9$KBP1~$7$?F3EE@-%Z!<%9%H$N@_7W$H3+H/(B
($B%O%j%^2=@.(B) $B!{;{ED(B $B?.?M(B		Conductive
Paste
Printed
4/14
12:42:48
97[$B>7BT9V1i(B]MORE THAN MOORE"$B$,@8$`%Q%i%@%$%`%7%U%H(B
($B%m!<%`(B) $B!{9b?\(B $B=(;k(B		Moor
Electronics
4/21
12:30:11
102$BEE2rF
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BC]ED(B $B0M2C(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>fLw(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electrodeposition
copper foil
flatness
4/21
15:09:37
107TSV$BEE5$F<$a$C$-$N9bB.2=(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BNS(B $BB@O:(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>fLw(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($B?7L@OB9)6H(B($B5;(B)) ($BIt(B)$B4]Cf(B $B@5M:(B$B!&(B($BIt(B)$BEZ20(B $B5.G7(B		TSV
electrodeposition
copper
4/21
16:34:56
141$BHy>.F
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B		copper plating
electrode reaction
diffusion of ion
4/22
17:06:43
147$B;0
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5\K\(B $BK-(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		water cooling
3-D package
numerical analysis
4/22
19:05:29
149$BHy>.N.O)$r1~MQ$7$?F<$a$C$-$K$*$1$kE:2C:^:nMQ$NDjNL2=(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B3X(B)$B5\K\(B $BK-(B$B!&(B$BI~It(B $BD>(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		adsorption rate
electrodeposition
copper
4/22
19:27:24
181$B%U%#%k%I%S%"$a$C$-$K$*$1$k%8%"%j%k7O%"%_%sE:2C:^$N8z2L(B(2)
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5WMx(B $B1QG7(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($BF|ElKB(B) $BJ820(B $B>!(B$B!&(B$BC]Fb(B $B		copper
electrodeposition
Via-filling
4/23
16:57:29
235$BHy>.9=B$J*$r4p:`$H$7$?(BFe-Ni-Co$B9g6b$a$C$-Kl$N:n@=(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$B2,K\(B $B>0$B!&(B$B;3ED(B $B2m;N(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		electrodeposition
alloy
film
4/26
09:46:59
441$B%U%j%C%W%A%C%W@\9gH>F3BN%Q%C%1!<%8$N?.Mj@-2r@O-7(B
($B=;M'%Y!<%/%i%$%H(B) $B!{H*Hx(B $BBnLi(B$B!&(B($B@5(B)$BEDCf(B $B9(G7(B$B!&(B($B5~Bg9)(B) $B4SLn(B $BIR;K(B$B!&(B$BCSED(B $BE0(B$B!&(B($B@5(B)$B5\:j(B $BB'9,(B		flip-chip
underfill
FEM
4/27
16:38:59
531AOT/$B%H%k%(%s7O(BW/O$B%(%^%k%7%g%s$rMQ$$$?%]%j%T%m!<%k$N9g@.(B
($BElM}Bg1!Am2=(B) $B!{(B($B3X(B)$BBgLZ(B $BCRM3(B$B!&(B($BElM}Bg9)(B) ($B@5(B)$B9b66(B $BCR51(B$B!&(B($B@5(B)$BBgC](B $B>!?M(B$B!&(B($B@5(B)$B>1Ln(B $B8|(B$B!&(B($B@5(B)$B>.NS(B $BBgM4(B		polypyrrole
emulsion
4/27
20:01:43
581$B468w@-%]%j%$%_%I$NB?9&2=$K$h$kDcM6EEN(2=5;=Q$N3+H/(B
($B5~Bg9)(B) $B!{(B($B@5(B)$BBm(B $B7rB@O:(B		low-k
porous film
4/28
00:37:43
591$BM-5!4p:`$N??6u%W%m%;%9E,MQ$K4X$9$k4pAC8!F$(B
($BF|N)2=@.9)6H(B) $B!{(B($B@5(B)$BCfB<(B $B1QGn(B		organic substrates
sensor
vacuum process
4/28
08:50:03
$B9V1i?=$79~$_0lMw(B($B%7%s%]%8%&%`HV9f!&9V1iJ,N`HV9fJL(B)
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$B2=3X9)3X2q(B $BBh(B42$B2s=)5(Bg2q(B
(C) 2010 ($B
Most recent update: 2010-06-21 20:19:01
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