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U103-U125

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$B%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9$K4X$9$k$9$Y$F$N8&5f$K4X$7$F!"8&5fH/I=$r8xJg$7$^$9!#FC$KH>F3BN:`NA!"%Q%C%1!<%8:`NA!"

$B:G=*99?7F|;~!'(B2010-09-03 10:20:57
$B9V1i(B
$B;~9o(B		$B9V1i(B
$BHV9f(B		$B9V1iBjL\!?H/I=$B%-!<%o!<%I(B$BJ,N`(B
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9:40$B!A(B 10:00U103$BEE2rF
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BC]ED(B $B0M2C(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$BsnF#(B $B>fLw(B $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B
electrodeposition
copper foil
flatness
S-5102
10:00$B!A(B 10:40U104[$B>7BT9V1i(B]$B
($B;:Am8&(B) $B!{6-(B $BE/CK(B
Battery
Next Generation
S-522
10:40$B!A(B 11:00U106$B468w@-%]%j%$%_%I$NB?9&2=$K$h$kDcM6EEN(2=5;=Q$N3+H/(B
($B5~Bg9)(B) $B!{(B($B@5(B)$BBm(B $B7rB@O:(B
low-k
porous film
S-5581
11:00$B!A(B 11:20U107$BHy>.9=B$J*$r4p:`$H$7$?(BFe-Ni-Co$B9g6b$a$C$-Kl$N:n@=(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$B2,K\(B $B>0 $B!&(B $B;3ED(B $B2m;N(B $B!&(B ($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B
electrodeposition
alloy
film
S-5235
11:20$B!A(B 11:40U108$B;0
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5\K\(B $BK-(B $B!&(B ($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B
water cooling
3-D package
numerical analysis
S-5147
11:40$B!A(B 12:00U109$B%U%j%C%W%A%C%W@\9gH>F3BN%Q%C%1!<%8$N?.Mj@-2r@O-7(B
($B=;M'%Y!<%/%i%$%H(B) $B!{H*Hx(B $BBnLi(B $B!&(B ($B@5(B)$BEDCf(B $B9(G7(B $B!&(B ($B5~Bg9)(B) $B4SLn(B $BIR;K(B $B!&(B $BCSED(B $BE0(B $B!&(B ($B@5(B)$B5\:j(B $BB'9,(B
flip-chip
underfill
FEM
S-5441

(13:00$B!A(B15:20)$B!!(B($B:BD9(B $BsnF#!!>f{J!&CfB
13:00$B!A(B 13:40U113[$B>7BT9V1i(B]MORE THAN MOORE"$B$,@8$`%Q%i%@%$%`%7%U%H(B
($B%m!<%`(B) $B!{9b?\(B $B=(;k(B
Moor
Electronics
S-597
13:40$B!A(B 14:00U115$B%U%#%k%I%S%"$a$C$-$K$*$1$k%8%"%j%k7O%"%_%sE:2C:^$N8z2L(B(2)
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5WMx(B $B1QG7(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B $B!&(B ($BF|ElKB(B) $BJ820(B $B>!(B $B!&(B $BC]Fb(B $B
copper
electrodeposition
Via-filling
S-5181
14:00$B!A(B 14:20U116$BHy>.F
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B
copper plating
electrode reaction
diffusion of ion
S-5141

14:40$B!A(B 15:00U118AOT/$B%H%k%(%s7O(BW/O$B%(%^%k%7%g%s$rMQ$$$?%]%j%T%m!<%k$N9g@.(B
($BElM}Bg1!Am2=(B) $B!{(B($B3X(B)$BBgLZ(B $BCRM3(B $B!&(B ($BElM}Bg9)(B) ($B@5(B)$B9b66(B $BCR51(B $B!&(B ($B@5(B)$BBgC](B $B>!?M(B $B!&(B ($B@5(B)$B>1Ln(B $B8|(B $B!&(B ($B@5(B)$B>.NS(B $BBgM4(B
polypyrrole
emulsion
S-5531
15:00$B!A(B 15:20U119$BM-5!4p:`$N??6u%W%m%;%9E,MQ$K4X$9$k4pAC8!F$(B
($BF|N)2=@.9)6H(B) $B!{(B($B@5(B)$BCfB<(B $B1QGn(B
organic substrates
sensor
vacuum process
S-5591
(15:20$B!A(B17:20)$B!!(B($B:BD9(B $B2.Ln!!J84]!&2,K\!!>0
15:20$B!A(B 15:40U120$BHy>.N.O)$r1~MQ$7$?F<$a$C$-$K$*$1$kE:2C:^:nMQ$NDjNL2=(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B3X(B)$B5\K\(B $BK-(B $B!&(B $BI~It(B $BD>(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B
adsorption rate
electrodeposition
copper
S-5149

16:00$B!A(B 16:40U122[$B>7BT9V1i(B]$B%W%j%s%F%C%I%(%l%/%H%m%K%/%9$KBP1~$7$?F3EE@-%Z!<%9%H$N@_7W$H3+H/(B
($B%O%j%^2=@.(B) $B!{;{ED(B $B?.?M(B
Conductive
Paste
Printed
S-523
16:40$B!A(B 17:00U124Si$B4SDLEE6K(B(TSV)$B$N(BCu$B%7!<%IKl$N:n@=$HI>2A(B
($B?7L@OB9)6H(B($B5;(B)) $B!{(B($BIt(B)$B4]Cf(B $B@5M:(B $B!&(B ($BIt(B)$BEZ20(B $B5.G7(B $B!&(B ($B:eI\Bg1!9)(B) ($B@5(B)$B6aF#(B $BOBIW(B $B!&(B ($B@5(B)$BsnF#(B $B>fLw(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B3X(B)$BNS(B $BB@O:(B
Sputter-Ion-Plating
Cu Seed
TSV
S-59
17:00$B!A(B 17:20U125TSV$BEE5$F<$a$C$-$N9bB.2=(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BNS(B $BB@O:(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$BsnF#(B $B>fLw(B $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B $B!&(B ($B?7L@OB9)6H(B($B5;(B)) ($BIt(B)$B4]Cf(B $B@5M:(B $B!&(B ($BIt(B)$BEZ20(B $B5.G7(B
TSV
electrodeposition
copper
S-5107
$B9V1i%W%m%0%i%`(B
$B2=3X9)3X2q(B $BBh(B42$B2s=)5(Bg2q(B
(C) 2010 ($B
Most recent update: 2010-09-03 10:20:57
For more information contact $B2=3X9)3X2q4X@>;YIt(B $BBh(B42$B2s=)5(Bg2q(B $BLd$$9g$;78(B
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