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copper4$B7o(B*
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electrodeposition
copper
leveler
4/18
14:39:44
130$BEE5$$a$C$-K!$K$h$k(BGe$B4pHD>e$X$N@d1oKl$N:n@=(B
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Infrared sensor
Germanium
insulator
4/22
14:57:17
153$BM-5!(B-$BL55!%J%N%3%s%]%8%C%H$rMQ$$$?F)L@%7%j%+%,%i%9$X$NF3EE@-GvKl7A@.$K4X$9$k8&5f(B
($B6eBg1!9)(B) $B!{(B($B3X(B)$B1JLn(B $B9(;J(B$B!&(B ($B@5(B)$BF#Ln(B $BLP(B$B!&(B ($B@5(B)$B3a86(B $BL->0(B
silica glass
nanocomposite
thin film
4/22
18:04:03
157$B%O%m%2%s2=%"%s%b%K%&%`$r9[2=:^$KMQ$$$?%"%b%N%5!<%^%kK!$K$h$k(BGaN$B7k>=:n@=(B
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gallium nitride
crystal growth
ammonothermal
4/22
18:10:34
164$BHy>.N.O)H?1~4o$rMQ$$$kF<$a$C$-MQM-5!7OE:2C:^$N5[C&Ce5sF0$N2r@O(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5\K\(B $BK-(B$B!&(B $BI~It(B $BD>(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B
copper
electrodeposition
organic additives
4/22
20:32:19
219$B9bB.(BTSV$BEE5$F<$a$C$-$r2DG=$K$9$k%l%Y%i!<$N:GE,2=(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BNS(B $BB@O:(B$B!&(B $BC]Fb(B $B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($B?7L@OB9)6H(B) ($B@5(B)$B4]Cf(B $B@5M:(B$B!&(B ($BIt(B)$BEZ20(B $B5.G7(B$B!&(B ($BF|ElKB(B) $BJ820(B $B>!(B
TSV
electrodeposition
copper
4/25
12:57:55
237$BD>@\%a%?%N!<%k7AG3NAEECS$N$?$a$N%W%i%:%^=E9g%"%K%*%sKl$N@_7W(B
($B@EBg9)(B) $B!{(B($B3X(B)$B9u=;(B $BCN90(B$B!&(B ($B3X(B)$B?7H~(B $B9,(B$B!&(B ($B3X(B)$B2,Eg(B $BNI$B!&(B ($B@5(B)$B?\F#(B $B2mIW(B
plasma polymerization
anion exchange membrane
DMAFC
4/25
14:33:05
324$BG3NAEECSEE6K?(G^$N;@AG4T85H?1~$K$*$1$k2a;@2=?eAG@8@.I>2A(B
($B@EBg9)(B) $B!{(B($B3X(B)$B>.Ln(B $B8-;VO:(B$B!&(B ($B3X(B)$BCfEh(B $B91NI(B$B!&(B ($B3X(B)$B>.Ln(B $BC#Li(B$B!&(B ($B@5(B)$B?\F#(B $B2mIW(B
PEFC
RRDE
Hydrogen peroxide
4/25
20:48:29
340$B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0K!$K$h$k(BCu$B%7!<%IKl$N:n@=(B
($B?7L@OB9)6H(B) $B!{(B($B@5(B)$B4]Cf(B $B@5M:(B$B!&(B $BEZ20(B $B5.G7(B$B!&(B $B>.@t(B $B9/9@(B$B!&(B ($B:eI\Bg1!9)(B) ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B3X(B)$BNS(B $BB@O:(B
Sputter-Ion-Plating
TSV
Cu seed
4/26
09:28:36
366$BEE5$F<$a$C$-$K$h$k9b%"%9%Z%/%HHf%9%k!<%[!<%k$N=
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B_@:j(B $B8xB@(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($B?7L@OB9)6H(B) ($B@5(B)$B4]Cf(B $B@5M:(B$B!&(B $BEZ20(B $B5.G7(B
erectrodeposition
copper
TSV
4/26
12:40:36
369$BGvKl%-%c%Q%7%?$N8&5f3+H/(B
($BLnED%9%/%j!<%s(B) $B!{(B($B@5(B)$BI~It(B $BFFE5(B$B!&(B $BHx4X(B $BLw9,(B$B!&(B $BD%(B $B0](B$B!&(B $BKRLn(B $B$B!&(B ($B@5(B)$B>.@n(B $BM5M@(B
Aerosol Chemical Vapor Deposition
Thin Film Capacitor
4/26
12:55:53
372$B%"%k%+%j6u5$EECS$N$?$a$N6d?(G^%+%=!<%I$N@_7W(B
($B@EBg9)(B) $B!{(B($B3X(B)$BC]2<(B $BM:B@(B$B!&(B ($B3X(B)$BF#K\(B $B?8B@O:(B$B!&(B ($B@5(B)$B?\F#(B $B2mIW(B
Ag catalyst
carbon
oxygen evolution reaction(OER)
4/26
13:16:22
386[$B>7BT9V1i(B] $B%H%h%?<+F0-MhEECS$N
($B%H%h%?<+EECS8&5fIt(B) $B!{@nK\(B $B9@Fs(B
hybrid vehicle
hybrid electric vehicle
battery
4/26
13:43:39
388[$B>7BT9V1i(B] $B=8@Q2=(BRF-MEMS$B$,9-$2$k?7$7$$%o%$%d%l%9DL?.5;=Q$H%f%S%-%?%9
($BN)L?4[BgM}9)(B) $B!{NkLZ(B $B7r0lO:(B
Wireless
RF-MEMS
resonator
4/26
13:49:48
436$B8GBN9bJ,;R7AG3NAEECS$NKlEAF3EY$NB,DjK!Hf3S(B
($B@EBg9)(B) $B!{(B($B3X(B)$BF#>k(B $B2mG7(B$B!&(B ($B3X(B)$B2,Eg(B $BNI$B!&(B ($B3X(B)$B9u=;(B $BCN90(B$B!&(B ($B@5(B)$B?\F#(B $B2mIW(B
Electrolyte membrane
Conductivity
Through-plane measurement
4/26
16:25:39
603$B1v2=BhFsF<%(%C%A%s%01U$K$h$kF<$NMO2rB.EY(B
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B
etching by cupric chloride
diffusion of ion
dissolving rate of copper
4/27
11:07:34
625$B%]%j%$%_%I%U%#%k%`$X$ND>@\L5EE2r$a$C$-$HG[@~4pHD$N:n@=(B
($B1'It6=;:(B) $B!{(B($B@5(B)$BHV>l(B $B7$B!&(B $B;01:(B $BE0(B$B!&(B $B9,ED(B $B@/J8(B$B!&(B $B2#Bt(B $B0KM5(B
Flexible printed circuits
Polyimide
Electroless plating
4/27
11:50:27
965LiFe1/3Mn1/3Co1/3PO4$B%J%N9=B$!&%J%NJ#9gBN@56K:`NA$N9g@.$H$=$N%j%A%&%`Fs
($BEl9)Bg1!M}9)(B) $B!{(B($B@5(B)$BC+8}(B $B@t(B$B!&(B ($B3X(B)$B=)85(B $BAo(B
Cathode
Lithium batteries
Olivine
4/27
20:32:48

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(C) 2011 $B8x1W
Most recent update: 2011-07-05 14:32:01
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