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SCEJ 46th Autumn Meeting (Fukuoka, 2014)

Session programs

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Symposium <Materials and Process in Electronics>

M101-M125

Most recent update: 2014-08-08 13:21:03
TimePaper
ID
Title / AuthorsKeywordsTopic codeAck.
number
Hall M, Day 1
(9:00–10:40) (Chair: Okamoto N., Kondo K.)
9:009:20M101Analysis of Cu(I) Complexes in Copper Sulfate Electroplating Solution by Using Reaction Kinetics with a Chelate Reagent
(AIST) Noma H., Koga T., Hirakawa C., Nonaka K.
Cu(I)-PEG complex
Chelate reagent
Bathocuproinedisulfonic acid disodium salt
S-13959
9:209:40M102Kinetic Monte Carlo simulation of TSV filling
(Kyoto U.) Kaneko Y., (Osaka P.U.) Hayashi T., Kondo K., (C.Uyemura & Co., Ltd.) Ohara K., Asa F.
through silicon via
kinetic Monte Carlo
additives
S-13146
9:4010:00M103Copper(I) ion concentration's distributions of the inside of through holes while electrodepositing
(Osaka Pref. U.) Matsuura S., Hayashi T., Kondo K., Yokoi M., Okamoto N., Saito T.
through hole via
copper electrodepositing
S-13325
10:0010:40M104Via filling electrodeposition- reaction and additives
(OsakaPrefectureUniversity) Yokoi Masayuki
Copper Electrodeposition
Additive
Reaction
S-1390
(10:40–12:00) (Chair: Ohtsuka K., Yokoi M.)
10:4011:00M106Diallylamine additive's effect on copper via filling
(Osaka Pref. U.) Yamada Y., Takeuchi M., Okamoto N., Saito T., (Nittobo) Bunya M., (Osaka Pref. U.) Yokoi M., Kondo K.
electrodeposition
additive
copper
S-1340
11:0011:20M107High Speed TSV Filiing by Using Cornic Via
(Osaka Pref.U.) Funahashi C., Okamoto N., Saito T., Yokoi M., Kondo K.
TSV
electro deposition
Copper
S-13173
11:2011:40M108Effect of via bottom cuprous ion concentration on via filling electrodeposition current
(Osaka Pref. U.) Hayashi T., Yokoi M., Okamoto N., Saito T., Kondo K.
Copper electrodeposition
cuprous ion concentration
current density
S-13153
11:4012:00M109Influence on the deposit reaction by monovalent copper and the additive in copper plating
(Osaka Pref. U.) Nishimura K., Okamoto N., Saito T., Yokoi M., Kondo K.
RRDE
copper
deposition
S-13175

(12:40–14:20) (Chair: Kimizuka R., Ohnuki J.)
12:4013:20M112Resistivity Reduction in Nano-Scale Cu Wires Using High-Purity Electrolyte
(Graduate School, Sci. and Tech., Ibaraki U.) Onuki Jin, Tamahashi Kunihiro, (Department of Materials Sci., Ibaraki U.) Sasajima Yasushi, Nagano Takatoshi
Cu Interconnects
Electroplating
Resistivity
S-13565
13:2013:40M114Acceleration of the copper electrodeposition reaction by small amount of Cl- Ions
(OsakaPref.U.) Kataoka K., Okamoto N., Saito T., Yokoi M., kondo K
electrodeposition
additives
copper
S-13174
13:4014:00M115Reduction of thermal expansion coefficient of electrodeposited copper for TSV
(Osaka Pref. U.) Mukahara S., Kondou K., Fukui K., Yokoi M., Takeuchi M., (Nittobo) Bunya M., (Osaka Pref. U.) Saito T., Okamoto N.
TSV
Copper
thermal expansion coefficient
S-13111
14:0014:20M116Copper Wire Transparent Conductive Film
(OPU) Kondo Kazuo, Ikeda Yuichi, Maki Yoshirou, Yokoi Masayuki, Okamoto Naoki, Saito Takeyasu
Copper
Electrodeposition
Transparent
S-13169
(14:20–16:00) (Chair: Saito T., Sudo M.)
14:2014:40M117Polyimide film for electroless plating corresponding to desmear processing
(UBE Inds. Ltd.) Miura Toru, Kohda Masahumi, Yokozawa Tadahiro
polyimide
desmear
electroless plating
S-13216
14:4015:00M118Energy analysis and efficiency of the fuel cell
(Kyoto U.) Ogino F.
fuel cell
energy analysis
cell efficiency
S-13115
15:0015:20M119Sn film prepared by electrodeposition as negative electrode for Na-ion secondary batteries
(Osaka Pref.U.) Morita K., Okamoto N., Saito T., Kondo K.
Na-ion battery
Sn
electrodeposition
S-13177
15:2015:40M120Mechanism of hydrogen peroxide formation in PEMFC under operating condition
(Shizuoka U.) Ohmura K., Okamoto Y., Itoh C., Sudoh M.
PEMFC
hydrogen peroxide
degradation
S-13223
15:4016:00M121Unsaturated and non-uniformly distributed water transport in the membrane for polymer electrolyte fuel cell.
(Shizuoka U.) Sugesawa Y., Shimokawa R., (Ryukyu U.) Minakuti H., (Shizuoka U.) Sudoh M.
PEFC
water transport
NWTC
S-13275
(16:00–17:20) (Chair: Takeuchi M., Marunaka M.)
16:0016:20M122Solubility behavior and crystal growth of GaN in super critical ammonia with doping metal
(Tohoku U. IMRAM) Ito M., Sato F., Tomida D., (The Japan Steel Works) Kurimoto K., Bao Q., (Mitsubishi Chemical) Saito M., (Tohoku U. IMRAM) Qiao K., Ishiguro T., Yokoyama C.
GaN
ammonothermal
solubility
S-13612
16:2016:40M123Optimal design of FPC made of porous PI
(Yamagata U.) Taki Kentaro, (SEI) Mizoguchi Akira, (Yamagata U.) Ito Hiroshi
porous
dielectric
film
S-1395
16:4017:00M124Discussion about the improvement plan for discharge characteristics of electric double layer capacitor
(Shizuoka U.) Nagasawa Y., Yasue T., Nakamura S., Sudoh M.
Electric double layer capacitor
porous electrode theory
activated carbon electrode
S-13251
17:0017:20M125Effective factors on discharge capacity of rechargeable alkaline zinc-air battery
(Shizuoka U.) Ida T, Suematsu N, Akutagawa S, Sudoh M
alkaline solution
electrodeposition
electrolyte flow
S-13293

Technical program
SCEJ 46th Autumn Meeting (Fukuoka, 2014)

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Most recent update: 2014-08-08 13:21:03
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