1. Applicant and speaker must meet one of the following:

   • SCEJ full member (incl. honorary member)
   • SCEJ student member
   • SCEJ educator member
   • SCEJ international full/concord/student member
   • Employee of SCEJ special, charter, or local charter member
   • Individual supporting member of any division of SCEJ
   • Employee of corporate supporting member of any division of SCEJ
   • Individual member of co-organizing academic societies or institutes
   • Invited speaker

2. The speaker who does not meet any of these requirements must join the Society of Chemical Engineers, Japan before registration to the meeting.

3. Only papers which have not been published or presented elsewhere can be presented at the meeting.

You can submit your application form on the web. Read the guideline of the respective way.

1. Topics code list
2. Guideline of application (Please read this!)
3. Application form
4. Inquiry about Application

You can make correction to your application form that has been submitted. The correction can be made on the web until the application deadline. Go to the ‘Correction of submitted application form’ page.

• Correction of submitted application form

Regarding the patent application including an invention presented at the SCEJ Meeting, contact the Headquarters Office of SCEJ.

You are requested to submit a manuscript of the preprint. A PDF file of the manuscript can be submitted over the Internet. See the instruction below.

The “Book of Preprints” will be published on line and in USB memory.

1. Manuscript preparation guideline (MS Word template file for preprint manuscript)
2. Uploading the manuscript file on the web
3. Manuscript submission form

The PDF file can be overwritten by uploading a revised version any times by the deadline. No submission and revision are allowed after the deadline of the manuscript submission.

• Uploading the manuscript file on the web

The format and style of the submitted manuscripts will be reviewed. Manuscripts in irregular styles would be rejected.