$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
---|---|---|---|---|---|
$B%(%l%/%H%m%K%/%9(B | |||||
(9:00$B!A(B10:20)$B!!(B($B:BD9(B $B2#;3(B $B@i><(B) | |||||
Q201 | Effect of the supplying pressure on impact stress in the snow dry-ice cleaning process for HDD assembly parts | Impact Stress Snow Dry-ice Carbon Dioxide | 11-a | 614 | |
Q202 | $B;@2=%A%?%s%J%N9=B$BN$K$*$1$k6a@\>l8w$rMQ$$$?8w?(G^H?1~$K4X$9$k8&5f(B | Optical Near-Filed Titanium dioxide nanorod Visible response photocatalyst | 11-a | 687 | |
Q203 | $BM-5!J*J,;R$NBg$-$5$H%7%j%3%sI=LL$K$*$1$k5[CeNL(B | Organic molecule silicon surface molecular radius | 11-a | 17 | |
Q204 | $BHy>.N.O)H?1~4o$rMQ$$$?F<$a$C$-MQM-5!7OE:2C:^$N5[C&CeB.EY$NI>2A(B | copper electrodeposition organic additives | 11-a | 504 | |
(10:20$B!A(B11:40)$B!!(B($B:BD9(B $B1)?<(B $BEy(B) | |||||
Q205 | Cu$B%7!<%IKl$N:n@=$H(BTSV$BI>2A(B | TSV EM $B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0(B | 11-a | 436 | |
Q206 | $BD6G.EAF3@\Ce%U%#%k%`$N3+H/(B | Thermal problem Thermal design Heat spreader | 11-c | 247 | |
Q207 | $BN2;@?eMO1UCf$K$*$1$kF<%$%*%s$N%^%$%0%l!<%7%g%s(B | diffusion of ion copper ion migration | 11-b | 318 | |
Q208 | $B;@@-9[2=:^$rMQ$$$?%"%b%N%5!<%^%kK!$K$h$k(BGaN$B7k>=:n@=(B | crystal growth gallium nitride supercritical ammonia | 11-i | 225 |