$B:G=*99?7F|;~!'(B2012-02-09 09:17:01
$B$3$NJ,N`$G$h$/;H$o$l(B $B$F$$$k%-!<%o!<%I(B | $B%-!<%o!<%I(B | $B | |
---|---|---|---|
etching by cupric chloride | 1$B7o(B | ||
$B?eN.(B | 1$B7o(B | ||
Cu Seed | 1$B7o(B | ||
$B%7%j%3%s%&%(%O(B | 1$B7o(B | ||
stagnation jet | 1$B7o(B | ||
pressure distribution | 1$B7o(B | ||
$B@v>t(B | 1$B7o(B | ||
TSV | 1$B7o(B | ||
Sputter-Ion-Plating | 1$B7o(B |
$B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $B | |
---|---|---|---|
18 | $BKgMU<0%7%j%3%s%&%(%O<><0@v>t5!$K$*$1$k?eN.4Q;!(B | $B@v>t(B $B?eN.(B $B%7%j%3%s%&%(%O(B | 11/20 21:30:27 |
167 | $B%N%:%k$+$iG[@~HD$K>WFM$9$k%(%C%A%s%01U$NN.$l(B | etching by cupric chloride stagnation jet pressure distribution | 12/6 21:32:48 |
404 | $B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0K!$K$h$k(BTSV$B$X$N(BCu$B%7!<%IKl$N:n@=(B | Sputter-Ion-Plating Cu Seed TSV | 12/9 13:32:00 |