SCEJ

$B2=3X9)3X2q(B $BBh(B77$BG/2q(B

$B9V1i%W%m%0%i%`!J2q>l!&F|DxJL!K(B

O$B2q>l(B $BBh(B1$BF|(B

$B:G=*99?7F|;~!'(B2012-03-09 14:23:08
$B9V1i(B
$B;~9o(B		$B9V1i(B
$BHV9f(B		$B9V1iBjL\!?H/I=$B%-!<%o!<%I(B$BJ,N`(B
$BHV9f(B		$B$BHV9f(B
$B%(%l%/%H%m%K%/%9(B
(13:00$B!A(B13:40)$B!!(B($B:BD9(B $BsnF#(B $B>f{J(B)
13:00$B!A(B 13:20O113$BKgMU<0%7%j%3%s%&%(%O<><0@v>t5!$K$*$1$k?eN.4Q;!(B
($B2#9qBg1!9)(B) $BBg66(B $B?7B@O:(B $B!&(B $BEZ;}(B $BBkIK(B $B!&(B $B!{(B($B@5(B)$B1)?<(B $BEy(B $B!&(B ($B%W%l%F%C%/(B) $BLZ2<(B $BE/CK(B
$B@v>t(B
$B?eN.(B
$B%7%j%3%s%&%(%O(B
11-a18
13:20$B!A(B 13:40O114$B%N%:%k$+$iG[@~HD$K>WFM$9$k%(%C%A%s%01U$NN.$l(B
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B
etching by cupric chloride
stagnation jet
pressure distribution
11-a167
(13:40$B!A(B14:20)$B!!(B($B:BD9(B $BBm(B $B7rB@O:(B)
13:40$B!A(B 14:00O115$B5^B.1UCV49$K$h$kF<$a$C$-MQM-5!7OE:2C:^$N5[Ce:nMQ$NDjNL2=(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5\K\(B $BK-(B $B!&(B $BI~It(B $BD>(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B
copper
electrodeposition
organic additives
11-b573
14:00$B!A(B 14:20O116MWCNTs$B>e$X$N6bB0@O=P@)8f(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B9bLZ(B $B9/9T(B $B!&(B ($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B@5(B)$B6aF#(B $BOBIW(B $B!&(B ($B:e;T9)8&(B) $B>.NS(B $BLwG7(B $B!&(B $BF#86(B $BM5(B
carbon nanotube
silver
electroless plating
11-b588
(14:20$B!A(B15:20)$B!!(B($B:BD9(B $B1)?<(B $BEy(B)
14:20$B!A(B 14:40O117$BC:;@%,%9$rMxMQ$7$?468w@-%]%j%$%_%IA06nBN$NB?9&2=$K$*$1$kM=Hw4%Ag$N1F6A(B
($B5~Bg9)(B) $B!{(B($B@5(B)$BBm(B $B7rB@O:(B $B!&(B ($B3X(B)$BK~^<(B $BM59,(B $B!&(B ($B@5(B)$BBgEh(B $B@5M5(B
dielectric
polyimide
drying
11-i436
14:40$B!A(B 15:00O118$B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0K!$K$h$k(BTSV$B$X$N(BCu$B%7!<%IKl$N:n@=(B
($B?7L@OB9)6H(B($B5;(B)) $B!{(B($B@5(B)$B4]Cf(B $B@5M:(B $B!&(B $BEZ20(B $B5.G7(B $B!&(B ($B:eI\Bg1!9)(B) ($B@5(B)$B6aF#(B $BOBIW(B $B!&(B ($B@5(B)$BsnF#(B $B>f{J(B $B!&(B ($B@5(B)$B2,K\(B $B>0 $B!&(B ($B3X(B)$BNS(B $BB@O:(B
Sputter-Ion-Plating
Cu Seed
TSV
11-a404
15:00$B!A(B 15:20O119$B%W%j%"%W%i%$%I7?@\B3:`NA$rMQ$$$?2A(B
($B=;M'%Y!<%/%i%$%H(B) $B!{@>@n(B $B2B $B!&(B $BA0Eg(B $B8&;0(B $B!&(B $B7K;3(B $B8g(B
Chip on chip
Bonding
Joint reliability
11-i574
$B9V1i%W%m%0%i%`(B
$B2=3X9)3X2q(B $BBh(B77$BG/2q(B
(C) 2012 $B8x1W
Most recent update: 2012-03-09 14:23:08
For more information contact $B2=3X9)3X2qBh(B77$BG/2q(B $BLd$$9g$;78(B
E-mail: inquiry-77awww3.scej.org
This page was generated by easp 2.28; proghtml 2.28b (C)1999-2011 kawase