Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
---|---|---|---|---|---|
Hall C | |||||
(13:00–14:30) (Chair: No data , No data ) | |||||
C17 | Effect of Enviromental Factors on heavy metal toxicity | Water temperature pH Salinity | 7-g | 52 | |
C18 | Analysis of host recognition mechanisms of Staphylococcus aureus specific bacteriophage ¦µSA012 | Staphylococcus aureus phage therapy CRISPR/Cas System | 7-d | 3 | |
C19 | Analysis of antibiotic-bacteria in the digestive tract of fly | Flesh fly Antibiotic-resistant bacteria Intestinal flora | 7-g | 4 | |
C20 | Experimental study on understanding transport of particles in agar matrix | hydrogel particle transport | 7-i | 76 | |
C21 | Effect of carbon sources in medium on activity of xylanase from Geobacillus sp. NTS46 | paper sludge xylanase Geobacillus sp. | 7-a | 26 | |
C22 | Analysis of Ammonia-assimilating mechanism by Alcaligenes sp. YK-1 of ammonia assimilating bacterium | Alcaligenes Ammonia-Assimilating mechanism ammonia assimilating bacterium | 7-b | 21 | |
(14:30–15:45) (Chair: Kazuhiko Miyanaga, No data ) | |||||
C23 | Study about the Dye Sensitized Solar Cells | Solar Cells Pigment Absorption spectrum | 11-a | 18 | |
C24 | Fundamental study of seed removal process with semi additive | etching semi additive copper | 11-c | 45 | |
C25 | addition agent effect to the etching of copper foil using sulfuricacid-hydrogenperoxide solution (HachinoheNational College of Technology) *Kimura Moe, | semi-additive method dissolution of seed layers dissolutionrate | 11-c | 58 | |
C26 | Spray etching of copper by cupric chloride solution | Copper Microcircuits Subtractive method | 11-c | 61 | |
C27 | galvanic corrosion between copper and aluminum for wire harnes of car | aluminum copper galvanic corrosion | 11-c | 49 |