$BBh(B1$BF|(B | |||||
---|---|---|---|---|---|
$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
$B%7%s%]%8%&%`(B $B!c%(%l%/%H%m%K%/%9$K4XO"$9$k6bB0;q8;$N%j%5%$%/%j%s%0!d(B | |||||
(10:00$B!A(B11:20)$B!!(B($B:BD9(B $B2.LnJ84](B) | |||||
Z104 | [$BE8K>9V1i(B]$B!!L5GQ4~J*7?M-2A6bB0%j%5%$%/%k5;=Q(B | metal recycle molecular structure complex formation | S-12 | 1069 | |
Z106 | [$BE8K>9V1i(B]$BHsE46bB0$N%j%5%$%/%j%s%0(B | non-ferrous metal metal recycling electric-vehicle | S-12 | 15 | |
(11:20$B!A(B12:00)$B!!(B($B;J2q(B $BEDCf44Li(B) | |||||
Z108 | [$BE8K>9V1i(B]$B!!7HBSEEOC$N%j%5%$%/%k(B | cellular phone recycle precious metals | S-12 | 1066 | |
(13:00$B!A(B14:20)$B!!(B($B:BD9(B $BCfB<1QGn(B) | |||||
Z113 | [$BE8K>9V1i(B]$B<><0=hM}5;=Q$r3hMQ$7$?6bB0$N2s<}(B | recycle metal hydrometallurgical process | S-12 | 396 | |
Z115 | $BB?:BCbAG%I%J! | extraction soft-donor soft metal | S-12 | 104 | |
Z116 | $B%7%j%3%s%9%i%C%8$*$h$SGQ4~%"%k%_%K%&%`$N%"%k%+%j=hM}$K$h$k?eAG!&%<%*%i%$%H$NF1;~@=B$(B | coproduction zeolite silicon sludge | S-12 | 159 | |
(14:20$B!A(B15:40)$B!!(B($B:BD9(B $BO7ED>05W(B) | |||||
Z117 | [$BE8K>9V1i(B]$BEE2r$K$h$k1v2=F<%(%C%A%s%01U$N%j%5%$%/%j%s%0(B | cupric chloride electrolysis recycle | S-12 | 130 | |
Z119 | $B%"%s%b%K%"%"%k%+%j@-$N?eMO1U$rMQ$$$?GQEE;R5!4o$+$i$NF<2s<}%W%m%;%9(B | copper recycling hydrometallurgical process ammonia | S-12 | 579 | |
Z120 | $B6bB0N22=J*$+$i$NF<$N%P%$%*%j!<%A%s%0(B | bioleaching copper metal sulfide | S-12 | 616 | |
(15:40$B!A(B16:20)$B!!(B($B;J2q(B $BC]2<7rFs(B) | |||||
Z121 | [$BE8K>9V1i(B]$B!!5.6bB0J,N%@:@=$K$*$1$k?75,Cj=P:^3+H/(B | precious metal metal recycle extraction | S-12 | 1055 | |
(16:20$B!A(B17:20)$B!!(B($B:BD9(B $BC]2<7rFs(B) | |||||
Z123 | SCN-$BFbJq7?%?%s%K%s%2%k(B/$B8w>H | Tannin gel Platinum group metals Gel extraction | S-12 | 774 | |
Z124 | $B4uGvMO1U$+$i$N%Q%i%8%&%`$N%P%$%*4T85!&2s<}(B | biomineralization bioreductive deposition palladium | S-12 | 691 | |
Z125 | $B4uGvMO1U$+$i$N6d$N%P%$%*4T85!&2s<}(B | biomineralization bioreductive deposition silver | S-12 | 614 | |
(17:20$B!A(B18:00)$B!!(B($B:BD9(B $B@n4nED1Q9'(B) | |||||
Z126 | $B&B(B-$B%5%$%"%m%s$N5!3#E*3h@-2=G3>F9g@.$H$=$NG.EAF3N(B,Dj(B | Combustion synthesis Sintering Thermal conductivity | S-12 | 1076 | |
Z127 | $B29EY%9%$%s%0%/%m%^%HK!$K$h$kM-2A6bB0$NL5GQ4~J*7?J,N%!&2s<}(B | thermosensitive gel thermal-swing chromatography metal recycle | S-12 | 1020 | |
$BBh(B2$BF|(B | |||||
$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
$B%7%s%]%8%&%`(B $B!c%(%l%/%H%m%K%/%9$K4XO"$9$k6bB0;q8;$N%j%5%$%/%j%s%0!d(B | |||||
(9:00$B!A(B10:20)$B!!(B($B:BD9(B $B@P0f@5?M(B) | |||||
Z201 | [$BE8K>9V1i(B]$B1U>=%Q%M%k$+$i$N%$%s%8%&%`$N2s<}%j%5%$%/%k(B | LCD indium recycle | S-12 | 40 | |
Z203 | $B;HMQ:Q$_1U>=%Q%M%k$+$i$N%$%s%8%&%`$N2s<}5;=Q$N3+H/(B | indium flat display panel adsorption | S-12 | 605 | |
Z204 | $B1U>=%Q%M%kMQF)L@EE6KEy$+$i$N4%<0K!$K$h$k%$%s%8%&%`2s<}(B | indium ammonium chloride pyrometallurgy | S-12 | 951 | |
$B%7%s%]%8%&%`(B $B!c | |||||
(10:40$B!A(B12:00)$B!!(B($B:BD9(B $B2,K\>0 | |||||
Z206 | $B%l!<%6! | Micropatterning Laser-induced pyrolysis Dielectric thin film | S-13 | 263 | |
Z207 | $B%>%k!>%2%kK!$K$h$k9bM6EE@-GvKl$N?75,Dc299g@.K!$N3+H/(B | Dielectric thin film Low temperature synthesis Barium titanate | S-13 | 446 | |
Z208 | $B%$%*%s%^%$%0%l!<%7%g%s$K$h$kG[@~4VC;Mm(B | ion migration diffusion of ion short circuit | S-13 | 2 | |
(13:00$B!A(B14:20)$B!!(B($B:BD9(B $B2.LnJ84](BE$BCfB<1QGn(B) | |||||
Z213 | [$BE8K>9V1i(B]$BEE5$F<$a$C$-$NKl8|6Q0l@-$H%U%#%j%s%0@-$N8~>e(B | copper electroplating thickness uniformity filling performance | S-13 | 109 | |
Z215 | PR$BEE2r$rMQ$$$?7jKd$a$a$C$-(B | electroplating copper damascene rotating electrode | S-13 | 54 | |
Z216 | $B<+8JAH?%2=C1J,;RKl%l%8%9%H$rMQ$$$kF<4pHD$N%1%_%+%k%(%C%A%s%0(B | Self-assembled monolayer etch resist copper substrate | S-13 | 1035 | |
(14:20$B!A(B16:00)$B!!(B($B:BD9(B $B:#Ln44CK(BE$BBg5WJ]Mx0l(B) | |||||
Z217 | Cu$B$a$C$-Kl$h$jH/@8$9$k%N%8%e!<%k$N@O=P5!9=$N8!F$(B | electroplating copper nodule | S-13 | 44 | |
Z218 | $B1U>=%]%j%^!<$rMQ$$$?%P%s%WFbB"4pHD$K$h$k0l3g@QAX$N4pAC8!F$(B | Concurrent Multi-layering Embedded Bump Substrate Liquid Crystal Polymer | S-13 | 16 | |
Z219 | $B9b%"%9%Z%/%H9&$X$N$a$C$-(B | electrodeposition copper higher aspect ratio | S-13 | 55 | |
Z220 | $BJ?3jF | copper foil profile-free printed wiring board | S-13 | 438 | |
Z221 | $B9b@-G=%]%j%^!<8wF3GHO)$+$i$J$k8wEE5$J#9gG[@~4pHD(B | Polymer waveguide OE hybrid circuit Surface mount technology | S-13 | 82 | |
$BBh(B3$BF|(B | |||||
$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
$B%7%s%]%8%&%`(B $B!cAOLt9)3X%7%s%]%8%&%`(B 21$B@$5*$NAOLt!&@=:^9)3X$H2=3X9)3X!d(B | |||||
(9:20$B!A(B10:00)$B!!(B($B;J2q(B $B8eF#2m9((B) | |||||
Z302 | [$BE8K>9V1i(B]$B$,$s:YK&$X$NHyN3;R$NI=LL?FOB@-$H%5%$%:8z2L(B | Cell adhesion up-take or endocytosis | S-28 | 1142 | |
(10:00$B!A(B10:20)$B!!(B($B:BD9(B $BD9Eo519T(B) | |||||
Z304 | [$BE8K>9V1i(B] $B!!0eLtMQ%"%_%N;@@=B$$K$*$1$k5;=Q3+H/%K!<%:$K$D$$$F(B | amino acid purification fermentation | S-28 | 1141 | |
(10:20$B!A(B11:00)$B!!(B($B;J2q(B $BFbEDGn5W(B) | |||||
Z305 | [$BE8K>9V1i(B]API$B@=B$%W%m%;%9$K$*$1$k>=@O9)Dx$N2]Bj(B | crystallization scale up active pharmaceutical | S-28 | 1143 | |
(11:00$B!A(B11:40)$B!!(B($B;J2q(B $B0KF# | |||||
Z307 | [$BE8K>9V1i(B]$B!!7k>=B?7A!&5 | Crystallization Polymorphism Crystallizer | S-28 | 1133 | |
(13:00$B!A(B13:40)$B!!(B($B;J2q(B $B>e%N;3<~(B) | |||||
Z313 | [$BE8K>9V1i(B]$B@=Lt!&@=:^%W%m%;%9$X$N%7%_%e%l!<%7%g%s5;=Q$NE,MQ(B | CFD Scale-up Optimization | S-28 | 824 | |
(13:40$B!A(B14:20)$B!!(B($B;J2q(B $BLJLn(B $BE/(B) | |||||
Z315 | [$BE8K>9V1i(B] $BHyN3;R%3!<%F%#%s%0!&%^%$%/%m%+%W%;%k2=%W%m%;%9(B-$BJ.N.AX%9%W%l! | Microgranulation Encapsulation Spouted bed spray-process | S-28 | 1140 | |
(14:20$B!A(B15:00)$B!!(B($B;J2q(B $B@nEg2EL@(B) | |||||
Z317 | [$BE8K>9V1i(B]$B!!@=:^%W%m%;%9$N%P%j%G!<%7%g%s$H:#8e$NF08~(B | validation PAT ICHQ8 | S-28 | 1137 | |
(15:00$B!A(B15:40)$B!!(B($B;J2q(B $B?yK\=SFsO:(B) | |||||
Z319 | [$BE8K>9V1i(B]$B!!0eLtIJ$NIJ | process analytical technology quality assurance physicochemical characterization | S-28 | 1139 | |
(15:40$B!A(B16:20)$B!!(B($B;J2q(B $B@nEg2EL@(B) | |||||
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