$BBh(B1$BF|(B | |||||
---|---|---|---|---|---|
$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
$B%7%s%]%8%&%`(B $B!c%W%m%;%96/2=$rL\;X$7$?%@%$%J%_%C%/$JH?1~$H0\F08=>]B%?J!d(B | |||||
(9:20$B!A(B10:20)$B!!(B($B:BD9(B $BJ?Ln(B $BGnG7(B) | |||||
H102 | $B3J;R%\%k%D%^%sK!$K$h$k(BPEFC$B3H;6AX$+$i%,%9N.O)$XM/=P$9$kHy>.1UE)$N5sF02r@O(B | PEFC Gas diffusion layer Lattice Boltzmann Method | S-18 | 814 | |
H103 | $B3J;R%\%k%D%^%sK!$K$h$kA:@-N.BNN.$l$N?tCM2r@O(B | Lattice Boltzmann method Bingham model Casson model | S-18 | 294 | |
H104 | $BAj8_:nMQ$9$k(BBelousov-Zhabotinsky$BH?1~G;EY?6F0;R72$K$*$1$kF14|8=>]$N2r@O(B | Connective Oscillator Synchronization Belousov-Zhabotinsky Reaction | S-18 | 225 | |
(10:20$B!A(B11:20)$B!!(B($B:BD9(B $BB@ED(B $B8w9@(B) | |||||
H105 | $B%^%$%/%mN.O)Fb$K$*$1$k8r8_N.$KM?$($kJ*@-CM$N1F6A(B | microchannel segmented flow Capillary number | S-18 | 623 | |
H106 | $B%N%s%(%l%a%s%H%_%-%5!<$NBPN.:.9g2aDx$K4X$9$k?tCM2r@OE*8!F$(B | non-element mixer chaos CFD | S-18 | 601 | |
H107 | $B%^%$%/%mN.O)Fb1U1UFsAjN.$l$N>uBV?dDj$N$?$a$N%/%i%9%?%j%s%0 | Self-Organizing Map Micro Chemical Process Clustering | S-18 | 134 | |
(11:20$B!A(B12:00)$B!!(B($B;J2q(B $B>>7((B $BMN2p(B) | |||||
H108 | [$BE8K>9V1i(B]$BG3NAEECS$H(BCO2$BCyN1$N8&5f3+H/$K$_$k(Bin situ$B7WB,$,$b$?$i$9?7E83+(B | fuel cell CO2 | S-18 | 539 | |
(13:00$B!A(B13:40)$B!!(B($B;J2q(B $BBgB<(B $BD>?M(B) | |||||
H113 | [$BE8K>9V1i(B] $B%^%$%/%m%j%"%/%?!<$rMQ$$$??(G^H?1~>l$N@_7W(B | Microreactor Catalytic Reactor Methanol Decomposition | S-18 | 752 | |
(13:40$B!A(B14:40)$B!!(B($B:BD9(B $B30NX(B $B7r0lO:(B) | |||||
H115 | $B%"%k%^%$%H?(G^$rMQ$$$?29EYHsDj>oA`:n%^%$%/%m%j%"%/%?!<$N8&5f(B | non-steady operation alumite catalyst micro reactor | S-18 | 109 | |
H116 | $B%9%W%l!<%Q%k%9K!$K$h$k(B2-$B%W%m%Q%N!<%kC&?eAGH?1~$N8&5f(B | spray pulse method non-steady operation dehydrogenation | S-18 | 110 | |
H117 | $BF0E*3IYBIt$r$b$D%_%j%j%"%/%?!<$N1U!=1UJ,;6FC@-(B | reactor design millireactor droplet formation | S-18 | 746 | |
(14:40$B!A(B15:40)$B!!(B($B:BD9(B $B2O9g(B $B=( | |||||
H118 | $B29EY<~4|A`:n2<$K$*$1$kIT6Q0l?(G^H?1~$NJ?6QH?1~B.EY$HAGH?1~$N29EY0MB8@-$N4X78(B | microreactor forced temperature cycling reaction rate | S-18 | 500 | |
H119 | $B?tCM2r@O$K$h$k9b8zN(%/%i%C%-%s%0%A%e!<%V$N3+H/(B | thermal cracking CFD Finned tube | S-18 | 457 | |
H120 | $B3&LL3h@-:^$H(BPVA$B$N:.9gE:2C:^$K$h$kI9%9%i%j!<$NI9@.D9M^@)8z2L(B | Ice Slurries Surfactants Ostwald Ripening | S-18 | 441 | |
(15:40$B!A(B16:40)$B!!(B($B:BD9(B $B:y0f(B $B@?(B) | |||||
H121 | $B%"%9%Z%/%HHf$N>.$5$$(BTaylor$B12$K$h$k8w9g@.Hy@8J*$NA}?#FC@-$K$D$$$F(B | Taylor Vortex Flow photo-bioreactor solid-liquid mixing | S-18 | 784 | |
H122 | $BE|Be | bioethanol xylose metabolic pathway fermentation | S-18 | 844 | |
H123 | $BO"B3F}2==E9g%W%m%;%96/2=$rL\;X$7$?%3%s%Q!<%H%a%s%HH?1~4o$N@-G=I>2A(B | continuous emulsion polymerization compartment reactor process intensification | S-18 | 449 | |
(16:40$B!A(B17:20)$B!!(B($B:BD9(B $BBgB<(B $BD>?M(B) | |||||
H124 | $BD62;GH<+8JAj4XK!$K$h$k(BTaylor$B12$NB.EYJ,I[7WB,(B | Taylor Vortex Flow Ultrasonic measurement Velocity profile | S-18 | 778 | |
H125 | $B%U%m%s$N8wC&1vAGH?1~$K$*$1$k(BNaOH$B$K$h$k1v8z2L$NB,Dj(B | Solubility Salting effect Henry's low constant | S-18 | 280 | |
$BBh(B2$BF|(B | |||||
$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
$B%7%s%]%8%&%`(B $B!c%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9!d(B | |||||
(13:00$B!A(B15:00)$B!!(B($B:BD9(B $B@P0f!!@5?M!&O7ED!!>05W(B) | |||||
H213 | $B6dG[@~!"F | ion migration short circuit Ag, Cu wiring | S-5 | 508 | |
H214 | $BM-5!4pHD$rMQ$$$?HyNL%$%*%s%;%s%7%s%0$K4X$9$k4pAC8!F$(B | self-assembling monolayer sensor reproducibility | S-5 | 447 | |
H215 | $B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0K!$rMQ$$$?(BCu$B%7!<%IKl$N:n@=$HI>2A(B | Cu Seed Electoro-Migration Through Silicon Via | S-5 | 43 | |
H216 | Si$B4SDLEE6K(B(TSV)$B$N9bB.(BCu$B$a$C$-(B | Copper TSV Electrodeposition | S-5 | 42 | |
H217 | $B%U%#%k%I%S%"$a$C$-$K$*$1$k%8%"%j%k%"%_%s7OE:2C:^$N8z2L(B | Copper Electrodeposition Via-filling | S-5 | 365 | |
H218 | $B9b%"%9%Z%/%HHf%-%c%S%F%#Fb$NN.F02r@O(B | high aspect ratio bump numerical analysis | S-5 | 671 | |
$BBh(B3$BF|(B | |||||
$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B | $BHV9f(B $B | |
$B%7%s%]%8%&%`(B $B!c%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9!d(B | |||||
(9:00$B!A(B10:40)$B!!(B($B:BD9(B $BCfB | |||||
H301 | $B%"%b%N%5!<%^%kK!$K$h$k(BGaN$BC17k>=0i@.$K$*$1$k6bB0?(G^$N8!F$(B | crystal growth gallium nitride supercritical ammonia | S-5 | 552 | |
H302 | $B%"%b%N%5!<%^%kK!$K$h$k(BGaN$BC17k>=0i@.$K$*$$$F0i@.29EY!&05NO$,M?$($k1F6A(B | crystal growth gallium nitride supercritical ammonia | S-5 | 565 | |
H303 | $B1v2=?eAG%,%9$K$h$k;@2=%O%U%K%&%`%(%C%A%s%0(B | HfO2 hi-k | S-5 | 34 | |
H304 | [$B>7BT9V1i(B]$B!!(BMEMS$BF08~(B | MEMS Life Packaging | S-5 | 45 | |
(10:40$B!A(B12:00)$B!!(B($B:BD9(B $B1)? | |||||
H306 | $B;@2=J*%J%N7k>=$N?eG.9g@.$H$=$NBO@Q$K$h$kEE3&8z2L%H%i%s%8%9%?$N7A@.(B | metal oxide nanocrystal drop cast field-effect transistor | S-5 | 791 | |
H307 | ZnS$B4pHD$KBP$9$k%9%k!<%[!<%k%U%#%j%s%0$a$C$-(B | ZnS deposition Cu | S-5 | 429 | |
H308 | [$B>7BT9V1i(B]$BEE;R%Z!<%Q!u67(B | Electronics Paper Packaging | S-5 | 444 | |
(13:00$B!A(B15:00)$B!!(B($B:BD9(B $B9b8+!!@?0l!&snF#!!>f{J(B) | |||||
H313 | [$B>7BT9V1i(B]$B!!M-5!%(%l%/%H%m%K%/%9!&%U%)%H%K%/%9$N:G6a$NE83+(B | Organic Device Printing | S-5 | 48 | |
H315 | $B%>%k%2%kK!$K$h$k;@2=0!1tF)L@F3EEKl$ND4@=(B | zinc oxide sol-gel method thin films | S-5 | 650 | |
H316 | ITO$B%J%NN3;R$rMQ$$$?%[%C%H%W%l%9K!$K$h$kF)L@F3EEKl(B | indium tin oxide hot-press nanoparticles | S-5 | 152 | |
H317 | $BF<%J%NN3;R$rMQ$$$?F3EEKl(B | Copper nanoparticles Conductive film Inkjet | S-5 | 153 | |
H318 | $B%$%a!<%8%;%s%5! | Adhesive Photodefinable Wafer level pakage | S-5 | 646 | |
(15:00$B!A(B16:40)$B!!(B($B:BD9(B $B2,K\!!>0 | |||||
H319 | [$B>7BT9V1i(B] LED$B<~JU5;=Q$N:G?75;=QF08~$H>-MhE8K>(B | LED Electronics Packaging | S-5 | 302 | |
H321 | $BEE2rF | Cu electrodeposition nodule | S-5 | 119 | |
H322 | $BHy>.7A>u$X$N(BNi$B$a$C$-Kl$N:n@=$H7A>u@)8f(B | electrodeposition nickel pattern | S-5 | 642 | |
H323 | FeCoNi$B;0859g6b$K$h$kHy>.9=B$J*$N:n@=$HAH@.@)8f(B | electrodeposition alloy pattern | S-5 | 818 |