SCEJ

$B2=3X9)3X2q(B $BBh(B41$B2s=)5(Bg2q(B

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$B:G=*99?7F|;~!'(B2009-09-07 16:36:42
$B9V1i(B
$B;~9o(B		$B9V1i(B
$BHV9f(B		$B9V1iBjL\!?H/I=$B%-!<%o!<%I(B$BJ,N`(B
$BHV9f(B		$B$BHV9f(B
$B%7%s%]%8%&%`(B $B!c%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9!d(B
(13:00$B!A(B15:00)$B!!(B($B:BD9(B $B@P0f!!@5?M!&O7ED!!>05W(B)
13:00$B!A(B 13:20H213$B6dG[@~!"F
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B		ion migration
short circuit
Ag, Cu wiring
S-5508
13:20$B!A(B 13:40H214$BM-5!4pHD$rMQ$$$?HyNL%$%*%s%;%s%7%s%0$K4X$9$k4pAC8!F$(B
($BF|N)2=@.9)6H(B) $B!{(B($B@5(B)$BCfB<(B $B1QGn(B		self-assembling monolayer
sensor
reproducibility
S-5447
13:40$B!A(B 14:00H215$B%9%Q%C%?%$%*%s%W%l!<%F%#%s%0K!$rMQ$$$?(BCu$B%7!<%IKl$N:n@=$HI>2A(B
($B?7L@OB(B) $B!{(B($BIt(B)$B4]Cf(B $B@5M:(B$B!&(B$BEZ20(B $B5.G7(B$B!&(B($B:eI\Bg1!9)(B) ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B		Cu Seed
Electoro-Migration
Through Silicon Via
S-543
14:00$B!A(B 14:20H216Si$B4SDLEE6K(B(TSV)$B$N9bB.(BCu$B$a$C$-(B
($B:eI\Bg1!9)(B) $B!{(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B$BNkLZ(B $BM5;N(B$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B?7L@OB(B) ($BIt(B)$B4]Cf(B $B@5M:(B$B!&(B$BEZ20(B $B5.G7(B		Copper
TSV
Electrodeposition
S-542
14:20$B!A(B 14:40H217$B%U%#%k%I%S%"$a$C$-$K$*$1$k%8%"%j%k%"%_%s7OE:2C:^$N8z2L(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B5WMx(B $B1QG7(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B($BF|ElKB(B) $BJ820(B $B>!(B$B!&(B$BC]Fb(B $B		Copper
Electrodeposition
Via-filling
S-5365
14:40$B!A(B 15:00H218$B9b%"%9%Z%/%HHf%-%c%S%F%#Fb$NN.F02r@O(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B>.;3(B $B5AB'(B$B!&(B$BNkLZ(B $BM5;N(B$B!&(B($B@5(B)$B2,K\(B $B>0$B!&(B($B@5(B)$BsnF#(B $B>f{J(B$B!&(B($B@5(B)$B6aF#(B $BOBIW(B		high aspect ratio
bump
numerical analysis
S-5671
$B9V1i%W%m%0%i%`(B
$B2=3X9)3X2q(B $BBh(B41$B2s=)5(Bg2q(B
(C) 2009 ($B
Most recent update: 2009-09-07 16:36:42
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