$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B $BHV9f(B | $B$BHV9f(B | |
$B%7%s%]%8%&%`(B <$B%(%l%/%H%m%K%/%9:`NA$H%W%m%;%9(B> |
(9:00$B!A(B10:40) ($B:BD9(B $B2,K\(B $B>0 |
9:00$B!A(B 9:20 | M101 | $BN2;@F
($B;:Am8&(B) $B!{(B($BIt(B)$BLn4V(B $B90><(B$B!&(B $B8E2l(B $B=JE/(B$B!&(B $BJ?@n(B $BCR7C;R(B$B!&(B $BLnCf(B $B0lMN(B | Cu(I)-PEG complex Chelate reagent Bathocuproinedisulfonic acid disodium salt
| S-13 | 959 |
9:20$B!A(B 9:40 | M102 | $BF0E*%b%s%F%+%k%mK!$K$h$k(BTSV$BKd$a9~$_$N%7%_%e%l!<%7%g%s(B
($B5~Bg>pJs(B) $B!{(B($B@5(B)$B6b;R(B $BK-(B$B!&(B ($B:eI\Bg9)(B) ($B3X(B)$BNS(B $BB@O:(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($B>eB<9)6HCf8&(B) $B>.86(B $B>!I'(B$B!&(B $B@u(B $BIY;NIW(B | through silicon via kinetic Monte Carlo additives
| S-13 | 146 |
9:40$B!A(B 10:00 | M103 | $B%9%k!<%[!<%k$a$C$-;~$N%9%k!<%[!<%kFbIt$N0l2AF
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B>>1:(B $BfF8g(B$B!&(B ($B3X(B)$BNS(B $BB@O:(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($B@5(B)$B2#0f(B $B>;9,(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$B@FF#(B $B>fLw(B | through hole via copper electrodepositing
| S-13 | 325 |
10:00$B!A(B 10:40 | M104 | [$B>7BT9V1i(B]$BF<$a$C$-H?1~$HE:2C:^$K$h$k7jKd$a$C$-(B
($B:eI\Bg(B) $B!{(B($BIt(B)$B2#0f(B $B>;9,(B | Copper Electrodeposition Additive Reaction
| S-13 | 90 |
(10:40$B!A(B12:00) ($B:BD9(B $BBgDM(B $BK.82!&2#0f(B $B>;9,(B) |
10:40$B!A(B 11:00 | M106 | $BF<7jKd$a$a$C$-$K$*$1$k%8%"%j%k%"%_%s7OE:2C:^$N1F6A(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B;3ED(B $B9/5.(B$B!&(B $BC]Fb(B $B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>fLw(B$B!&(B ($BF|ElKB(B) $BJ820(B $B>!(B$B!&(B ($B:eI\Bg1!9)(B) $B2#0f(B $B>;9,(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B | electrodeposition additive copper
| S-13 | 40 |
11:00$B!A(B 11:20 | M107 | $B1_?m7?%S%"7A>u$K$h$k(BTSV$B9bB.Kd$a9~$_$a$C$-(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BA%66(B $B@@NI(B$B!&(B ($B:eI\Bg9)(B) ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B:eI\Bg1!9)(B) ($BIt(B)$B2#0f(B $B>;9,(B$B!&(B ($B:eI\Bg9)(B) ($B@5(B)$B6aF#(B $BOBIW(B | TSV electro deposition Copper
| S-13 | 173 |
11:20$B!A(B 11:40 | M108 | $B%S%"DlIt$N(BCu+$B%$%*%sG;EY$,$a$C$-EEN.$KM?$($k1F6A(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BNS(B $BB@O:(B$B!&(B $B2#0f(B $B>;9,(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>fLw(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B | Copper electrodeposition cuprous ion concentration current density
| S-13 | 153 |
11:40$B!A(B 12:00 | M109 | $BF<$a$C$-$K$*$1$k0l2AF<$HE:2C:^$K$h$k@O=PH?1~$X$N1F6A(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B@>B<(B $B8wJ?(B$B!&(B ($B:eI\Bg(B) ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$Bc7F#(B $B>f{J(B$B!&(B ($BIt(B)$B2#0f(B $B>;9,(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B | RRDE copper deposition
| S-13 | 175 |
(12:40$B!A(B14:20) ($B:BD9(B $B7/DM(B $BN<0l!&Bg4S(B $B?N(B) |
12:40$B!A(B 13:20 | M112 | [$B>7BT9V1i(B]$B9b=cEYHy>.F<$a$C$-$HDq938:>/5!9=(B
($B0q>kBg1!M}9)(B) $B!{(B($B@5(B)$BBg4S(B $B?N(B$B!&(B $B6L66(B $BK.M5(B$B!&(B ($B0q>kBg9)(B) $B$B!&(B $B1JLn(B $BN4IR(B | Cu Interconnects Electroplating Resistivity
| S-13 | 565 |
13:20$B!A(B 13:40 | M114 | Cl-$BE:2C$K$h$kF<@O=PH?1~B%?J5sF0$N8&5f(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$BJR2,(B $B7rB@O:(B$B!&(B ($B:eI\Bg9)(B) ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($BIt(B)$B2#0f(B $B>;9,(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B | electrodeposition additives copper
| S-13 | 174 |
13:40$B!A(B 14:00 | M115 | $BEE5$F<$a$C$-K!$G:n@=$7$?F<(BTSV$B$NG.@~KDD%$NDc8:(B
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B8~86(B $B?B8g(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B $BJ!0f(B $B9qGn(B$B!&(B $B2#0f(B $B>;9,(B$B!&(B $BC]Fb(B $B$B!&(B ($BF|ElKB(B) $BJ820(B $B>!(B$B!&(B ($B:eI\Bg1!9)(B) ($B@5(B)$BsnF#(B $B>fLw(B$B!&(B ($B@5(B)$B2,K\(B $B>0 | TSV Copper thermal expansion coefficient
| S-13 | 111 |
14:00$B!A(B 14:20 | M116 | $BF<%o%$%d$a$C$-F)L@F3EEKl(B
($B:eI\Bg(B) $B!{(B($B@5(B)$B6aF#(B $BOBIW(B$B!&(B $BCSED(B $BM50l(B$B!&(B $BKR(B $BA1O/(B$B!&(B $B2#0f(B $B>;9,(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B | Copper Electrodeposition Transparent
| S-13 | 169 |
(14:20$B!A(B16:00) ($B:BD9(B $BsnF#(B $B>fLw!&?\F#(B $B2mIW(B) |
14:20$B!A(B 14:40 | M117 | $B%G%9%_%"%W%m%;%9BP1~!!D>@\$a$C$-MQ%]%j%$%_%I%U%#%k%`(B
($B1'It6=;:(B) $B!{(B($BK!(B)$B;01:(B $BE0(B$B!&(B ($BK!(B)$B9,ED(B $B@/J8(B$B!&(B ($BK!(B)$B2#Bt(B $B0KM5(B | polyimide desmear electroless plating
| S-13 | 216 |
14:40$B!A(B 15:00 | M118 | $BG3NAEECS$N%(%M%k%.!<2r@O$H8zN((B
($B5~Bg(B) $B!{(B($B@5(B)$B2.Ln(B $BJ84](B | fuel cell energy analysis cell efficiency
| S-13 | 115 |
15:00$B!A(B 15:20 | M119 | Na$B%$%*%sFs
($B:eI\Bg1!9)(B) $B!{(B($B3X(B)$B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>fLw(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B | Na-ion battery Sn electrodeposition
| S-13 | 177 |
15:20$B!A(B 15:40 | M120 | $B8GBN9bJ,;R7AG3NAEECS$N1?E>;~$N2a;@2=?eAG@8@.5!9=(B
($B@EBg1!9)(B) $B!{(B($B3X(B)$BBgB<(B $B8w:n(B$B!&(B ($B@5(B)$B2,K\(B $BM4$B!&(B ($B@EBg9)(B) $B0KF#(B $B@i9I(B$B!&(B ($B@EBg1!9)(B) ($B@5(B)$B?\F#(B $B2mIW(B | PEMFC hydrogen peroxide degradation
| S-13 | 223 |
15:40$B!A(B 16:00 | M121 | $B8GBN9bJ,;R7AG3NAEECS$NITK0OB!&IT6Q0lJ,I[$NKlFb?eM"Aw(B
($B@EBg1!9)(B) $B!{(B($B3X(B)$B?{Bt(B $B9,Bg(B$B!&(B $B2<@n(B $BN<2p(B$B!&(B ($BN05eBg9)(B) $B?e8}(B $B>0(B$B!&(B ($B@EBg1!9)(B) ($B@5(B)$B?\F#(B $B2mIW(B | PEFC water transport NWTC
| S-13 | 275 |
(16:00$B!A(B17:20) ($B:BD9(B $BC]Fb(B $B |
16:00$B!A(B 16:20 | M122 | $B6bB0E:2C>r7o$K$*$1$k(BGaN$B$ND6NW3&%"%s%b%K%"$KBP$9$kMO2r5sF0$H7k>=@.D9(B
($BElKLBgB?858&(B) $B!{(B($B3X(B)$B0KF#(B $B$_$:$-(B$B!&(B $B:4F#(B $BJ!GO(B$B!&(B ($B@5(B)$BIZED(B $BBgJe(B$B!&(B ($BF|@=9](B) $B7*K\(B $B9@J?(B$B!&(B $BJq(B $BA44n(B$B!&(B ($B;0I)2=3X(B) $B@FF#(B $B??(B$B!&(B ($BElKLBgB?858&(B) ($B@5(B)$B6,(B $B_c(B$B!&(B $B@P9u(B $BE0(B$B!&(B ($B@5(B)$B2#;3(B $B@i><(B | GaN ammonothermal solubility
| S-13 | 612 |
16:20$B!A(B 16:40 | M123 | $BB?9&7?D6DcM6EEB;<:%U%l%-%7%V%k(BFPC$B$N:GE,@_7W$N;n$_(B($B$=$N(B2)
($B;37ABg9)(B) $B!{(B($B@5(B)$BBm(B $B7rB@O:(B$B!&(B ($B=;M'EE9)(B) $B9B8}(B $B98(B$B!&(B ($B;37ABg9)(B) $B0KF#(B $B9@;V(B | porous dielectric film
| S-13 | 95 |
16:40$B!A(B 17:00 | M124 | $BEE5$Fs=EAX%-%c%Q%7%?$NJ|EEFC@-8~>e:v$N9M;!(B
($B@EBg1!9)(B) $B!{(B($B3X(B)$BD9Bt(B $BM:N<(B$B!&(B $B0B9>(B $BCR9-(B$B!&(B ($B@EBg9)(B) $BCfB<(B $BAa?%(B$B!&(B ($B@5(B)$B?\F#(B $B2mIW(B | Electric double layer capacitor porous electrode theory activated carbon electrode
| S-13 | 251 |
17:00$B!A(B 17:20 | M125 | $B%"%k%+%j?eMO1U0!1t(B-$B6u5$Fs
($B@EBg1!9)(B) $B!{(B($B3X(B)$B0fED(B $BE0(B$B!&(B ($B@EBg9)(B) $BKv>>(B $BD>Li(B$B!&(B $B3)@n(B $B:;?%(B$B!&(B ($B@EBg1!9)(B) ($B@5(B)$B?\F#(B $B2mIW(B | alkaline solution electrodeposition electrolyte flow
| S-13 | 293 |