SCEJ 46th Autumn Meeting (Fukuoka, 2014): Hall and day program

`SCEJ 46th Autumn Meeting (Fukuoka, 2014)`

Hall and day program

Hall M, Day 1

Most recent update: 2014-08-08 13:21:03

Time	Paper ID	Title / Authors	Keywords	Topic code	Ack. number
Symposium <Materials and Process in Electronics>
(9:00–10:40) (Chair: Okamoto N., Kondo K.)
9:00– 9:20	M101	Analysis of Cu(I) Complexes in Copper Sulfate Electroplating Solution by Using Reaction Kinetics with a Chelate Reagent (AIST) Noma H., Koga T., Hirakawa C., Nonaka K.	Cu(I)-PEG complex Chelate reagent Bathocuproinedisulfonic acid disodium salt	S-13	959
9:20– 9:40	M102	Kinetic Monte Carlo simulation of TSV filling (Kyoto U.) Kaneko Y., (Osaka P.U.) Hayashi T., Kondo K., (C.Uyemura & Co., Ltd.) Ohara K., Asa F.	through silicon via kinetic Monte Carlo additives	S-13	146
9:40– 10:00	M103	Copper(I) ion concentration's distributions of the inside of through holes while electrodepositing (Osaka Pref. U.) Matsuura S., Hayashi T., Kondo K., Yokoi M., Okamoto N., Saito T.	through hole via copper electrodepositing	S-13	325
10:00– 10:40	M104	Via filling electrodeposition- reaction and additives (OsakaPrefectureUniversity) Yokoi Masayuki	Copper Electrodeposition Additive Reaction	S-13	90
(10:40–12:00) (Chair: Ohtsuka K., Yokoi M.)
10:40– 11:00	M106	Diallylamine additive's effect on copper via filling (Osaka Pref. U.) Yamada Y., Takeuchi M., Okamoto N., Saito T., (Nittobo) Bunya M., (Osaka Pref. U.) Yokoi M., Kondo K.	electrodeposition additive copper	S-13	40
11:00– 11:20	M107	High Speed TSV Filiing by Using Cornic Via (Osaka Pref.U.) Funahashi C., Okamoto N., Saito T., Yokoi M., Kondo K.	TSV electro deposition Copper	S-13	173
11:20– 11:40	M108	Effect of via bottom cuprous ion concentration on via filling electrodeposition current (Osaka Pref. U.) Hayashi T., Yokoi M., Okamoto N., Saito T., Kondo K.	Copper electrodeposition cuprous ion concentration current density	S-13	153
11:40– 12:00	M109	Influence on the deposit reaction by monovalent copper and the additive in copper plating (Osaka Pref. U.) Nishimura K., Okamoto N., Saito T., Yokoi M., Kondo K.	RRDE copper deposition	S-13	175
(12:40–14:20) (Chair: Kimizuka R., Ohnuki J.)
12:40– 13:20	M112	Resistivity Reduction in Nano-Scale Cu Wires Using High-Purity Electrolyte (Graduate School, Sci. and Tech., Ibaraki U.) Onuki Jin, Tamahashi Kunihiro, (Department of Materials Sci., Ibaraki U.) Sasajima Yasushi, Nagano Takatoshi	Cu Interconnects Electroplating Resistivity	S-13	565
13:20– 13:40	M114	Acceleration of the copper electrodeposition reaction by small amount of Cl- Ions (OsakaPref.U.) Kataoka K., Okamoto N., Saito T., Yokoi M., kondo K	electrodeposition additives copper	S-13	174
13:40– 14:00	M115	Reduction of thermal expansion coefficient of electrodeposited copper for TSV (Osaka Pref. U.) Mukahara S., Kondou K., Fukui K., Yokoi M., Takeuchi M., (Nittobo) Bunya M., (Osaka Pref. U.) Saito T., Okamoto N.	TSV Copper thermal expansion coefficient	S-13	111
14:00– 14:20	M116	Copper Wire Transparent Conductive Film (OPU) Kondo Kazuo, Ikeda Yuichi, Maki Yoshirou, Yokoi Masayuki, Okamoto Naoki, Saito Takeyasu	Copper Electrodeposition Transparent	S-13	169
(14:20–16:00) (Chair: Saito T., Sudo M.)
14:20– 14:40	M117	Polyimide film for electroless plating corresponding to desmear processing (UBE Inds. Ltd.) Miura Toru, Kohda Masahumi, Yokozawa Tadahiro	polyimide desmear electroless plating	S-13	216
14:40– 15:00	M118	Energy analysis and efficiency of the fuel cell (Kyoto U.) Ogino F.	fuel cell energy analysis cell efficiency	S-13	115
15:00– 15:20	M119	Sn film prepared by electrodeposition as negative electrode for Na-ion secondary batteries (Osaka Pref.U.) Morita K., Okamoto N., Saito T., Kondo K.	Na-ion battery Sn electrodeposition	S-13	177
15:20– 15:40	M120	Mechanism of hydrogen peroxide formation in PEMFC under operating condition (Shizuoka U.) Ohmura K., Okamoto Y., Itoh C., Sudoh M.	PEMFC hydrogen peroxide degradation	S-13	223
15:40– 16:00	M121	Unsaturated and non-uniformly distributed water transport in the membrane for polymer electrolyte fuel cell. (Shizuoka U.) Sugesawa Y., Shimokawa R., (Ryukyu U.) Minakuti H., (Shizuoka U.) Sudoh M.	PEFC water transport NWTC	S-13	275
(16:00–17:20) (Chair: Takeuchi M., Marunaka M.)
16:00– 16:20	M122	Solubility behavior and crystal growth of GaN in super critical ammonia with doping metal (Tohoku U. IMRAM) Ito M., Sato F., Tomida D., (The Japan Steel Works) Kurimoto K., Bao Q., (Mitsubishi Chemical) Saito M., (Tohoku U. IMRAM) Qiao K., Ishiguro T., Yokoyama C.	GaN ammonothermal solubility	S-13	612
16:20– 16:40	M123	Optimal design of FPC made of porous PI (Yamagata U.) Taki Kentaro, (SEI) Mizoguchi Akira, (Yamagata U.) Ito Hiroshi	porous dielectric film	S-13	95
16:40– 17:00	M124	Discussion about the improvement plan for discharge characteristics of electric double layer capacitor (Shizuoka U.) Nagasawa Y., Yasue T., Nakamura S., Sudoh M.	Electric double layer capacitor porous electrode theory activated carbon electrode	S-13	251
17:00– 17:20	M125	Effective factors on discharge capacity of rechargeable alkaline zinc-air battery (Shizuoka U.) Ida T, Suematsu N, Akutagawa S, Sudoh M	alkaline solution electrodeposition electrolyte flow	S-13	293

Technical program
SCEJ 46th Autumn Meeting (Fukuoka, 2014)

© 2014 The Society of Chemical Engineers, Japan. All rights reserved.
Most recent update: 2014-08-08 13:21:03
For more information contact Organizing Committee, SCEJ 46th Autumn Meeting (Fukuoka, 2014)
E-mail: inquiry-46f

www3.scej.org

This page was generated by