SCEJ 47th Autumn Meeting (Sapporo, 2015): List of the applications (topics)

Most recent update: 2016-01-20 13:09:01

The keywords that frequently used in this toopics code.	Keywords	Number
	electrodeposition	3
	Copper	2
	additive	2
	micro-contact printing	1

ACKN No.	Title/Author(s)	Keywords	Style
17	Low TEC Copper Electrodeposition (Osaka Pref. U.) *Kondo Kazuo, Mukahara Shingo, Yokoi Masayuki	Copper Electrodeposition Thermal Expansion Coefficient	O
23	[Invited lecture] TSV solution in ULVAC (ULVAC) Morikawa Yasuhiro	TSV Etcher Plasma	O
25	[Invited lecture] Monte Calro computation of via filling and additive by Copper electrodeposition (Kyoto U.) Kaneko Yutaka	Monte Calro Copper electrodeposition Additive	O
31	[Invited lecture] Microvia and Through-Hole Filling by Electroplating for Electronic Circuit Fabrication (Nat. Chung Hsing U.) Dow W.-P.	Copper Via additive	O
107	[Invited lecture] Device technology in Cognitive Computer System (GNC) Takeno Yasuhiko	デバイス CCS 半導体	O
217	printed pattern of nucleating agent ink for electroless plating with micro-contact printing method (AIST) *Tokoro K., Onoue M., Shirakawa N., Ushijima H., (Nissan Chemical) Kojima K., Chikama K.	printed electronics Electrodeposition micro-contact printing	O
340	The modeling of TSV filling by using Monte Carlo Simulation (Kyoto U.) *Tsugo Takahiro, Kaneko Yutaka	Monte Carlo Simulation Through-silicon via Additives	O
402	High-Speed Through Silicon Via (TSV) Filling (Osaka Pref. U.) *Hoang Van Ha, Kondo Kazuo	high speed TSV filling 3D packaging electrolyte optimization	O
419	Kinetic on Copper Damascene (Electroplating )and Cuprous Concentration Computation in the presence of Cl- and SPS (Osaka Pref. U.) *Hoang Van Ha, Kondo Kazuo, Yokoi Masayuki	TSV filling Cuprous Copper plating kinetic	O
736	Electrodeposition simulation in the manufacturing process of electrolytic copper foil (FITEC) *Ishimaru Y., Miyazaki S., (FURUKAWA ELECTRIC) Orita N.	electrodeposition simulation electrolytic copper foil	O

List of received applications (By topics code)

List of received applications
SCEJ 47th Autumn Meeting (Sapporo, 2015)

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Most recent update: 2016-01-20 13:09:01
For more information contact Organizing Committee, SCEJ 47th Autumn Meeting (Sapporo, 2015)
E-mail: inquiry-47f

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`SCEJ 47th Autumn Meeting (Sapporo, 2015)`

List of received applications (By topics code)

SE) SCEJ Division session

SE-10. Materials and Process in Electronics (Oral)