SCEJ 47th Autumn Meeting (Sapporo, 2015): Session programs

`SCEJ 47th Autumn Meeting (Sapporo, 2015)`

Session programs

SCEJ Division session SE-10. <Materials and Process in Electronics>

N104-N121

Most recent update: 2015-08-26 10:00:42

Time	Paper ID	Title / Authors	Keywords	Topic code	Ack. number
Hall N, Day 1
(10:00–12:00) (Chair: Tokoro K., Kaneko Y.)
10:00– 10:20	N104	Low TEC Copper Electrodeposition (Osaka Pref. U.) *Kondo Kazuo, Mukahara Shingo, Yokoi Masayuki	Copper Electrodeposition Thermal Expansion Coefficient	SE-10	17
10:20– 10:40	N105	printed pattern of nucleating agent ink for electroless plating with micro-contact printing method (AIST) *Tokoro K., Onoue M., Shirakawa N., Ushijima H., (Nissan Chemical) Kojima K., Chikama K.	printed electronics Electrodeposition micro-contact printing	SE-10	217
10:40– 11:00	N106	Electrodeposition simulation in the manufacturing process of electrolytic copper foil (FITEC) *Ishimaru Y., Miyazaki S., (FURUKAWA ELECTRIC) Orita N.	electrodeposition simulation electrolytic copper foil	SE-10	736
11:00– 11:20	N107	High-Speed Through Silicon Via (TSV) Filling (Osaka Pref. U.) *Hoang Van Ha, Kondo Kazuo	high speed TSV filling 3D packaging electrolyte optimization	SE-10	402
11:20– 11:40	N108	The modeling of TSV filling by using Monte Carlo Simulation (Kyoto U.) *Tsugo Takahiro, Kaneko Yutaka	Monte Carlo Simulation Through-silicon via Additives	SE-10	340
11:40– 12:00	N109	Kinetic on Copper Damascene (Electroplating )and Cuprous Concentration Computation in the presence of Cl- and SPS (Osaka Pref. U.) *Hoang Van Ha, Kondo Kazuo, Yokoi Masayuki	TSV filling Cuprous Copper plating kinetic	SE-10	419

(13:00–14:20) (Chair: Kondo K.)
13:00– 13:40	N113	[Invited lecture] Microvia and Through-Hole Filling by Electroplating for Electronic Circuit Fabrication (Nat. Chung Hsing U.) Dow W.-P.	Copper Via additive	SE-10	31
13:40– 14:20	N115	[Invited lecture] Device technology in Cognitive Computer System (GNC) Takeno Yasuhiko	$B%G%P%$%9(B CCS $BH>F3BN(B	SE-10	107

(14:40–16:00) (Chair: Takeno Y., Orita N.)
14:40– 15:20	N118	[Invited lecture] TSV solution in ULVAC (ULVAC) Morikawa Yasuhiro	TSV Etcher Plasma	SE-10	23
15:20– 16:00	N120	[Invited lecture] Monte Calro computation of via filling and additive by Copper electrodeposition (Kyoto U.) Kaneko Yutaka	Monte Calro Copper electrodeposition Additive	SE-10	25

Technical program
SCEJ 47th Autumn Meeting (Sapporo, 2015)

© 2015 The Society of Chemical Engineers, Japan. All rights reserved.
Most recent update: 2015-08-26 10:00:42
For more information contact Organizing Committee, SCEJ 47th Autumn Meeting (Sapporo, 2015)
E-mail: inquiry-47f

www3.scej.org

This page was generated by