$B9V1i(B $B;~9o(B | $B9V1i(B $BHV9f(B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $BJ,N`(B $BHV9f(B | $B$BHV9f(B | |
O $B2q>l!&Bh(B 2 $BF|(B |
(13:00$B!A(B14:00) ($B:BD9(B $B6LCV(B $BD> |
13:00$B!A(B 13:40 | O213 | [$BE8K>9V1i(B] 3D$B%a%b%j;~Be$N%W%m%;%95;=QE8K>(B
($BEl | semiconductor fabrication process technology 3D memory
| SY-9 | 129 |
13:40$B!A(B 14:00 | O215 | $BD6NW3&MOBN$N29EY8{G[$rMxMQ$7$?%"%s%H%i%;%s@=Kl$K$*$1$k2aK0OBEY$*$h$SG;EY$N1F6A(B
($BElBg1!9)(B) ($B3X(B)$B!{K-AR(B $B>MB@(B$B!&(B ($B@5(B)$B2<;3(B $BM52p(B$B!&(B ($B@5(B)$BAz3@(B $B9,9@(B$B!&(B ($B@5(B)$BI4@%(B $B7r(B | Supercritical CO2 anthracene crystallization
| SY-9 | 156 |
(14:00$B!A(B15:00) ($B:BD9(B $B2O@%(B $B85L@(B) |
14:00$B!A(B 14:20 | O216 | $B%3%s%U%)!<%^%k$JD6NW3&N.BNBO@Q$K$*$1$k(BCO2$B05NO$N1F6A(B
($BElBg1!9)(B) ($B3X(B)$B!{%A%g%&(B $B%f%&(B$B!&(B ($B@5(B)$BI4@%(B $B7r(B$B!&(B ($B@5(B)$B2<;3(B $BM52p(B$B!&(B ($B@5(B)$BAz3@(B $B9,9@(B | supercritical fluid deposition pressure kinetics
| SY-9 | 543 |
14:20$B!A(B 14:40 | O217 | $BD6NW3&MOBN5^B.KDD%K!$K$h$k(BTIPS$B%Z%s%?%;%sGvKlAO@=$HM-5!GvKl%H%i%s%8%9%?$NFC@-I>2A(B
($B?.=#Bg1!M}9)(B) ($B3X(B)$B!{2FL\(B $B$B!&(B ($B3X(B)$B9b66(B $BM$BA(B$B!&(B ($B?.=#Bg1!Am9)(B) ($B3X(B)$BF#0f(B $BN5Li(B$B!&(B ($B?.=#Bg9)(B) ($B@5(B)$BFbED(B $BGn5W(B | Supercritical carbon dioxide TIPS-pentacene thin films Organic thin film transistor (OTFT)
| SY-9 | 668 |
14:40$B!A(B 15:00 | O218 | $BD6NW3&Fs;@2=C:AG$rMQ$$$?;@2=E4GvKl$N:n@.(B
($B:eI\Bg1!(B) ($B3X(B)$B!{3Q(B $B2E?M(B$B!&(B ($B:eI\Bg(B) ($B3X(B)$BEaG)(B $B@5Mx(B$B!&(B ($B:eI\Bg1!(B) ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($BElKLBgB?858&(B) ($B@5(B)$B9b8+(B $B@?0l(B | supercritical CO2 FeRAM iron oxide
| SY-9 | 758 |
(15:00$B!A(B16:00) ($B:BD9(B $B2<;3(B $BM52p(B) |
15:00$B!A(B 15:20 | O219 | [$B>7BT9V1i(B] $B9b05(BCO2$BE:2C$K$h$kG4EYDc2<$rMxMQ$7$?9b05J.L8@.Kl5;=Q(B
($B;:Am8&!&2=3X%W%m%;%98&5fItLg(B) $B!{@nyu(B $B?50lO/(B$B!&(B ($BElKLBg(B) $BNkLZ(B $BL@(B | high pressure carbon dioxide spray deposition viscosity
| SY-9 | 131 |
15:20$B!A(B 15:40 | O220 | $BD6NW3&N.BN$rMQ$$$?(BTiO2$B%J%N:Y9&$X$N(BCuInS2$BKd$a9~$_@.Kl(B
($BElKLBgB?858&(B) ($B3X(B)$B!{0B0f(B $BMFFs(B$B!&(B ($B3X(B)$BCf0B(B $BM4B@(B$B!&(B ($BElBg9)(B) ($B@5(B)$BI4@%(B $B7r(B$B!&(B ($BElKLBgB?858&(B) ($B@5(B)$Bcx5o(B $B9bL@(B$B!&(B ($B@5(B)$BK\4V(B $B3J(B | supercritical fluid deposition nanostructure compound semiconductor
| SY-9 | 442 |
15:40$B!A(B 16:00 | O221 | $B%W%i%:%^(BCVD$BK!$rMQ$$$?%7%j%+7O%,%9%P%j%"Kl$N:n@=$H%,%9F)2aB.EY$NB,Dj(B
($B5~Bg9)(B) ($B3X(B·$B5;4p(B)$B!{BgDE(B $B7<9,(B$B!&(B ($B3X(B)$BC]ED(B $B0M2C(B$B!&(B ($B@5(B)$B2O@%(B $B85L@(B | plasma CVD silica-based film gas barrier
| SY-9 | 757 |
(16:00$B!A(B17:00) ($B:BD9(B $B1)?<(B $BEy(B) |
16:00$B!A(B 16:20 | O222 | $B%W%i%:%^(BCVD$BK!$G:n@=$7$?%7%j%+Kl$N2=3X9=B$$HKlFC@-(B
($B5~Bg9)(B) ($B3X(B)$B!{C]ED(B $B0M2C(B$B!&(B ($B3X(B)$B=P8}(B $BMx$B!&(B ($B3X(B·$B5;4p(B)$BBgDE(B $B7<9,(B$B!&(B ($B@5(B)$B2O@%(B $B85L@(B | plasma CVD chemical structure film properties
| SY-9 | 815 |
16:20$B!A(B 16:40 | O223 | $B0[$J$kC:AG8;$rMQ$$$?%W%i%:%^(BCVD$B$K$h$k%+!<%\%s%J%N%&%)!<%k$N9g@.$H$=$NFC@-I>2A(B
($BEl9)Bg1!M}9)(B) ($B3X(B)$B!{?7@n(B $BBg$B!&(B ($B@5(B)$B?9(B $B?-2p(B | carbon nanowall carbon monoxide
| SY-9 | 897 |
16:40$B!A(B 17:00 | O224 | $B%0%i%U%'%s$N
($BAaBg1!@h?JM}9)(B) ($B3X(B)$B!{Bg@n(B $BD+M[(B$B!&(B ($B@5(B)$BD9C+@n(B $B3>(B$B!&(B ($B@5(B)$BLnED(B $BM%(B | Graphene Chemical vapor deposition Nucleation and growth
| SY-9 | 605 |
O $B2q>l!&Bh(B 3 $BF|(B |
(9:00$B!A(B10:00) ($B:BD9(B $BCSED(B $B7=(B) |
9:00$B!A(B 9:20 | O301 | $BHy:Y%H%l%s%A$K$*$1$k@=KlJ*
($BElBg1!9)(B) ($B3X(B)$B!{gULg(B $BM$0l(B$B!&(B ($B3X(B)$BEh(B $B9IJ?(B$B!&(B ($B3X(B)$B:4F#(B $BEP(B$B!&(B $B?y1:(B $B=(=S(B$B!&(B ($B3X(B)$BCf86(B $BBsLi(B$B!&(B (IHI$B4pHW8&(B) ($B@5(B)$BJ!Eg(B $B9/G7(B$B!&(B ($BElBg1!9)(B) ($B@5(B)$BI4@%(B $B7r(B$B!&(B ($B@5(B)$BAz3@(B $B9,9@(B | reactivity analysis fine trench Chemical Vapor Deposition
| SY-9 | 861 |
9:20$B!A(B 9:40 | O302 | $BD69b%"%9%Z%/%HHf%_%/%m%-%c%S%F%#$rMQ$$$?(BSiC-CVI$BK!$N%b%G%j%s%0(B
($BElBg1!9)(B) ($B3X(B)$B!{Eh(B $B9IJ?(B$B!&(B ($B3X(B)$B:4F#(B $BEP(B$B!&(B ($B3X(B)$BgULg(B $BM$0l(B$B!&(B $B?y1:(B $B=(=S(B$B!&(B ($B3X(B)$BCf86(B $BBsLi(B$B!&(B (IHI$B4pHW8&(B) ($B@5(B)$BJ!Eg(B $B9/G7(B$B!&(B ($BElBg1!9)(B) ($B@5(B)$BI4@%(B $B7r(B$B!&(B ($B@5(B)$BAz3@(B $B9,9@(B | CVD SiC methyltrichlorosilane
| SY-9 | 747 |
9:40$B!A(B 10:00 | O303 | $B86NAC:2=?eAG
($B5~Bg9)(B) ($B3X(B·$B5;4p(B)$B!{GO>l(B $BfFJ?(B$B!&(B ($B3X(B)$B4d0f(B $BK-I'(B$B!&(B ($B3X(B)$BD9ED(B $BfF(B$B!&(B ($B@5(B)$B2O@%(B $B85L@(B | CVD Pyrolysis Carbon
| SY-9 | 278 |
(10:00$B!A(B11:00) ($B:BD9(B $B?9(B $B?-2p(B) |
10:00$B!A(B 10:20 | O304 | $BF3F~%,%9$r@Z$jBX$($k(BCVD$B%W%m%;%9$NHsDj>o%,%9N.$l%7%_%e%l!<%7%g%s(B
($B%"%F%J%7%9(B) ($B@5(B)$BCSED(B $B7=(B | CVD ALD simulation
| SY-9 | 608 |
10:20$B!A(B 10:40 | O305 | SiHCl3$B$K$h$k%7%j%3%s@.Kl;~$NI{@8@.J*7A@.5!9=(B
($B2#9qBg1!9)(B) $B:y0f(B $B$"$f$_(B$B!&(B $Bc7F#(B $B$"$fH~(B$B!&(B ($B@5(B)$B!{1)?<(B $BEy(B | Silicon epitaxial growth trichlorosilane by-products
| SY-9 | 11 |
10:40$B!A(B 11:00 | O306 | $B1vAG(B-$B%1%$AG4^2=9gJ*$rMQ$$$?(BCVD$B$G$N2
($BElBg1!9)(B) ($B3X(B)$B!{:4F#(B $BEP(B$B!&(B ($B3X(B)$BEh(B $B9IJ?(B$B!&(B ($B3X(B)$BgULg(B $BM$0l(B$B!&(B $B?y1:(B $B=(=S(B$B!&(B ($B3X(B)$BCf86(B $BBsLi(B$B!&(B (IHI$B4pHW8&(B) ($B@5(B)$BJ!Eg(B $B9/G7(B$B!&(B ($BElBg1!9)(B) ($B@5(B)$BI4@%(B $B7r(B$B!&(B ($B3X0L$B!&(B ($BElBg1!9)(B) ($B@5(B)$BAz3@(B $B9,9@(B | silicon-chlorine compounds by-products elementary reaction simulation
| SY-9 | 840 |
(11:00$B!A(B12:00) ($B:BD9(B $BAz3@(B $B9,9@(B) |
11:00$B!A(B 11:20 | O307 | $BM-5!H>F3BN:`NA>:2Z@:@=%W%m%;%9$N2r@O(B
($BElBg1!9)(B) ($B3X(B)$B!{4dCK(B $BBs:H(B$B!&(B ($B@5(B)$B;38}(B $BM34tIW(B$B!&(B ($BElBg4D0B%;(B/$BElBg1!9)(B) ($B@5(B)$BDT(B $B2B;R(B | sublimation purification organic semiconductors
| SY-9 | 468 |
11:20$B!A(B 11:40 | O308 | $B5$AjK!$K$h$k(BAg-TiO2$B%J%NN3;R:.9gBO@QKl$N:n@=(B
($B9-Bg1!9)(B) ($B3X(B·$B5;4p(B)$B!{A}ED(B $B1Q9b(B$B!&(B $BED0f(B $BM*2p(B$B!&(B ($B@5(B)$B5WJ](B $BM%(B$B!&(B ($B@5(B)$BEgED(B $B3X(B | PECVD Nanoparticle synthesis PVD
| SY-9 | 273 |
11:40$B!A(B 12:00 | O309 | [$B>7BT9V1i(B] $BH>F3BN%W%m%;%9MQM-5!6bB086NA$N@_7W!"9g@.$*$h$S(BALD$B$X$NE,MQ(B
($B%(%"!&%j%-!<%I(B) Dussarrat Christian | atomic layer deposition conformal growth reaction mechanism
| SY-9 | 132 |
|
(13:00$B!A(B14:00) ($B:BD9(B $BLnED(B $BM%(B) |
13:00$B!A(B 13:40 | O313 | [$BE8K>9V1i(B] $B2=9gJ*H>F3BN%J%N%o%$%d$N%X%F%m%(%T%?%-%7%c%k@.D9$HE8K>(B
($BKLBgNL;R=8@Q%(%l%/%H%m%K%/%98&5f%;(B) $B!{IZ2,(B $B9n9-(B$B!&(B $BK\5W(B $B=g0l(B$B!&(B $BJ!0f(B $B9';V(B | compound semiconductor nanowire heteroepitaxial growth
| SY-9 | 128 |
13:40$B!A(B 14:00 | O315 | $BG.(BCVD $BK!$G:n@=$7$?;@2=0!1tGvKl$NFC@-(B
($BEl3$Bg1!9)(B) ($B3X(B)$B!{9uED(B $B?88c(B$B!&(B ($BEl3$Bg9)(B) $B5WJ](B $B;K9a(B$B!&(B $B2#;3(B $BM%5.(B$B!&(B $BEOn5(B $B2m=S(B$B!&(B ($BEl3$Bg1!9)(B) $BBg5WJ](B $BC#@8(B$B!&(B ($B@5(B)$B=);3(B $BBY?-(B | CVD Zinc oxide transparent conductive film
| SY-9 | 767 |
(14:00$B!A(B15:00) ($B:BD9(B $B=);3(B $BBY?-(B) |
14:00$B!A(B 14:20 | O316 | $B0[$J$k;@AG05NO$G:n@=$7$?F3EE@-;@2=J*EE6K$rM-$9$k6/M6EEBN%-%c%Q%7%?$NEE5$FC@-(B
($B:eI\Bg1!9)(B) ($B3X(B)$B!{9bED(B $B`v;R(B$B!&(B ($B3X(B)$BE7Ln(B $BBY2O(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B $B5HB<(B $BIp(B$B!&(B $BF#B<(B $B5*J8(B$B!&(B ($B:eBg;:8&(B) $BHu8}(B $B9(Fs(B$B!&(B $BKLEg(B $B>4(B | Ferroelectric capacitor pulsed laser deposition oxygen pressure
| SY-9 | 645 |
14:20$B!A(B 14:40 | O317 | p$B7?%@%$%d%b%s%I>e$K(BEB$B>xCeK!$G7A@.$7$?(BTi$B2=9gJ*(B/Pt/Au$BEE6K$N(BTLM$BI>2A(B
($B:eI\Bg1!9)(B) ($B3X(B)$B!{NkLZ(B $BAo0lO:(B$B!&(B ($B@5(B)$B2,K\(B $B>0$B!&(B ($B@5(B)$BsnF#(B $B>f{J(B$B!&(B ($B@5(B)$B6aF#(B $BOBIW(B$B!&(B ($B;:Am8&(B) $B>>K\(B $BMc(B$B!&(B $BKRLn(B $B=S@2(B$B!&(B $B>.AR(B $B@/I'(B$B!&(B $B2CF#(B $BCh8w(B$B!&(B $BC]Fb(B $BBgJe(B$B!&(B $B;3:j(B $BAo(B$B!&(B $BBg6z(B $B=(@$(B | diamond contact resistance electron beam evaporated
| SY-9 | 787 |
14:40$B!A(B 15:00 | O318 | [$B>7BT9V1i(B] $BCb2=J*GvKl$NHy:Y9=B$@)8f$H%i%8%+%k$rMQ$$$?Dc29$G$N@.KlJ}K!(B
($BKL8+9)Bg(B) $B!{Ip;3(B $B??5](B$B!&(B $B:4F#(B $B>!(B$B!&(B $BLnLp(B $B8|(B | nitride thin film sputtering radical nitridization
| SY-9 | 130 |
(15:00$B!A(B15:40) ($B:BD9(B $BsnF#(B $B>f{J(B) |
15:00$B!A(B 15:20 | O319 | $B5^B.>xCe$H$=$N>lMOM;7k>=2=$K$h$kBgN37B7k>=(BSi$BGvKl:n@=K!$N3+H/(B
($BAaBg@h?JM}9)(B) ($B3X(B)$B!{;3:j(B $BM*J?(B$B!&(B ($B@5(B)$BD9C+@n(B $B3>(B$B!&(B ($B@5(B)$BBgBt(B $BMxCK(B$B!&(B ($B@5(B)$BLnED(B $BM%(B | crystalline silicon thin films vapor deposition liquid phase crystallization
| SY-9 | 643 |
15:20$B!A(B 15:40 | O320 | CVD$B$K$h$k&A(B-Al2O3$BGvKl$NG[8~@-@)8f(B
($BElBg9)(B) ($B3X(B)$B!{@>_7(B $B7E(B$B!&(B ($BElBg1!9)(B) ($B@5(B)$BI4@%(B $B7r(B$B!&(B ($B5~%;%i(B) $BC+^<(B $B1I?N(B$B!&(B ($BElBg1!9)(B) ($B@5(B)$BAz3@(B $B9,9@(B | CVD Al2O3 crystal-orientation
| SY-9 | 827 |