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SCEJ 48th Autumn Meeting (Tokushima, 2016)

List of received applications (By topics code)

SY) SCEJ Division Symposium

SY-82. Symposium of Electronics Division: Materials and Process in Electronics


Most recent update: 2016-11-29 11:54:01

The keywords that frequently used
in this topics code.		KeywordsNumber
electrodeposition2
electroplating2
micro-contact printing1

ACKN
No.		Title/Author(s)KeywordsStyle
1Advanced analysis of electroplating on patterned wafers
(Keisoku Eng. Sys.) *(Cor)Tong Lizhu, (Cor)Nagayama Tatsuhiko, (COMSOL AB) Henrik Ekstrom		Electroplating
Patterned wafer
Numerical analysis
O
101Fabrication of Fine-pitch Copper Wiring by Micro-contact Printing and Plating Using Nucleating Agent Ink
(AIST) *(Div)Tokoro K., Onoue M., Shirakawa N., Ushijima H., (Nissan Chemical Industries) (Cor)Kojima K., (Cor)Chikama K.		printed electronics
micro-contact printing
electrodeposition
O
585[Invited lecture] Determination of reaction rate constants of copper electrodeposition on a rotating disk electrode and using for simulation of the cuprous concentration inside TSVs
(Osaka Pref. U.) *(Ful)Hoang Van Ha, (Osaka Pref. U..) (Ful)Kondo Kazuo		Copper electrodeposition
TSV filling
cuprous
O
588Detection of cuprous ions by micro ring electrodes on a TSV side wall
(Osaka Pref. U.) *(Ful)Hoang Van Ha, (Ful)Kondo Kazuo		Cuprous detection
micro electrode
TSV
O
650[Invited lecture] Progress of the current distribution analysis technology of electrolytic cell
(MUSASHI GIKEN LLC.) (Div)Ohara Katsuhiko		electrolytic cell
current distribution analysis
calculation
O
679[Invited lecture] Nano-Structure Controlled Very Low Resistivity Cu Wires By High Purity Plating
(Ibaraki U.) *Onuki Jin, Tamahashi Kunihiro, Itou Masahiko, Onuma Shigeharu, Inami Takashi, Namekawa Takashi, Honma Yoshio		Nano-level Cu Wire
High Purity Electrolyte
Microstructure Analysis
O
776[Invited lecture] The trend of Advance in Semiconductor package technology in IoT era
(Grobal Net) (Div)Takeno Yasuhiko		IoT
Semiconductor Package
3D
O
926NiFe Plating Film for Magnetic Sensor and Magnetic Compass
(Tosetz) *(Ful)Miyake Yuko, (Div)Shimizu Sanae, (Div)Matsui Kousuke, (Div)Maruyama Takafumi, (Div)Koizumi Yuichi		NiFe
electroplating
magnetic sensor
O
993High speed Cu electrodeposition in φ12inch-wafer size electrodeposition apparatus
(Tosetz) *(Ful)Miyake Yuko, (Div)Koizumi Yuichi, (Div)Matsui Kousuke, (Div)Maruyama Takafumi		High speed Cu plating
electrodeposition
electrolytic plating apparatus
O
List of received applications (By topics code)
List of received applications
SCEJ 48th Autumn Meeting (Tokushima, 2016)
(C) 2016 The Society of Chemical Engineers, Japan. . All rights reserved.
Most recent update: 2016-11-29 11:54:01
For more information contact Organizing Committee, SCEJ 48th Autumn Meeting (Tokushima, 2016)
E-mail: inquiry-48fwww3.scej.org
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