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SCEJ 88th Annual Meeting (Tokyo, 2023) / / IChES 2023

List of received applications (By topics code)


11) Electronics

11-e. Interconnection (adhesion, bonding, etc.)

Most recent update: 2023-05-12 20:59:01

The keywords that frequently used
in this topics code.
KeywordsNumber
Cu paste1
vacuum ultraviolet1
microstructure1
medium vacuum sputtering1
anisotropic conductive film1
Necking1
corrosion1
cellulose nanofiber1
adhesion strength1
interstital atom1
sponge structure1
Sintering1

ACKN
No.
Title/Author(s)KeywordsStyle
18Improvement of adhesion of copper seed using vacuum ultraviolet irradiation equipment and medium vacuum sputtering equipment
(Ushio) (Stu)Endo Shinichi
adhesion strength
medium vacuum sputtering
vacuum ultraviolet
P
19Investigating the possibility of sintering Cu paste at low temperature -2nd report-
(Sumitomo Metal Mining) *(Cor)Hanzawa Kazuki, (Cor)Kashiwaya Satoshi
Sintering
Cu paste
Necking
O
343Studying the Effect of Interstitial Elements in Fe-based Alloys on their Corrosion Resistance using Density Functional Theory
(Nat. Central U.) *Chu Yu-Min, Chien Szu-Chia
corrosion
interstital atom
microstructure
P
543Development of anisotropic conductive film with sponge structure using cellulose nanofibers and silver particles
(Waseda U.) *(Stu)Oshima Yumi, Kawakami Satoru, (Waseda U.) (Reg)Noda Suguru
anisotropic conductive film
sponge structure
cellulose nanofiber
P

List of received applications (By topics code)

List of received applications
SCEJ 88th Annual Meeting (Tokyo, 2023)
IChES 2023

(C) 2023 The Society of Chemical Engineers, Japan. . All rights reserved.
Most recent update: 2023-05-12 20:59:01
For more information contact Organizing Committee, SCEJ 88th Annual Meeting (Tokyo, 2023) / / IChES 2023
E-mail: inquiry-88awww3.scej.org
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