Title (J) field includes “熱硬化性樹脂”; 1 program is found.
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Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
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Day 2 | PC217 | Development of thermally-stable thermal interface material using thermosetting resin | Thermal interface material Thermosetting resin Thermal resistance | 12-a | 330 |
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SCEJ 89th Annual Meeting (Sakai, 2024)