Last modified: 2017-09-06 10:00:00
Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
---|---|---|---|---|---|
SY-78 [Symposium of Division of Electronics] Electronics Materials and Process | |||||
(14:00–16:40) (Chair: | |||||
BC116 | [Invited lecture] Recent topics in power device | Energy Power device Wire | SY-78 | 42 | |
BC118 | [Invited lecture] Introduction to FO-WLP Technology | electronics Packaging Core Less PCB FO-WLP | SY-78 | 31 | |
BC120 | Low thermal expansion coefficient electrodeposited copper and its contraction mechanism by annealing | Copper electrodeposition TEC | SY-78 | 30 | |
BC121 | [Keynote lecture] Characteristics and enterprise of low thermal expansion coefficient copper electrodeposit | Copper Electrodeposition TEC | SY-78 | 28 | |
BC123 | Rotating ring disk electrode study to detect the acceleration effect of MPS with Chloride | Copper Electrodeposition Acceleration | SY-78 | 29 |
Technical program
Technical sessions (Wide)
(For narrow screen)
Session programs
Search in technical program
SCEJ 49th Autumn Meeting (Nagoya, 2017)