Title (J) field includes “配線用”; 1 program is found.
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Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
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Day 1 | S116 | Development of Molybdenum Atomic Layer Deposition Process for Next Generation ULSI Interconnect | ALD Molybdenum interconnect | ST-24 | 845 |
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SCEJ 54th Autumn Meeting (Fukuoka, 2023)