SCEJSCEJ SCEJ 52nd Autumn Meeting Sep. 22 (Wed) - Sep. 24 (Fri), 2021 Okayama University, Tsushima Campus Japanese page
Last Update: 2021-09-18 16:09:12

General Information & Schedule

General Information

The Meeting is planning to be an On-site/Virtual hybrid meeting. (Part of the oral sessions use bidirectional live streaming from the on-site venue.) All presentations will be streamed on the internet.

Date Sep. 22(Wed) - 24(Fri), 2021
* The session SP-1 will start from Sept. 21.
Venue (on-site) Tsushima Campus, Okayama Univ. [access]
Venue (on-line) All sessions will be attended from the SCEJ GOING VIRTUAL.
(The ID/PW will be sent to the registered participants and invited persons.)
Major Programs


The banquet is cancelled, but an online event (no extra charge) will be held. (Sept. 23 18:20-).

Plenary lecture

The Plenary lecture by Ph.D., Dr.Eng. Martin Green, the 2021 Japan Prize Winner, will be held (Sept. 23. 17:00-18:00).


Application May 6(Thu) - 11:59 pm of Jun. 15(Tue), 2021
Preprint Manuscript Submission July 1(Thu) - 11:59 pm of August 25(Wed), 2021
Preprints OPEN September 8(Wed), 2021
Poster Submission July 1(Thu) - 11:59 pm of September 15(Wed), 2021
(Poster presentation only)
Registration Period-I : July 1(Thu) - August 11(Wed), 2021
Period-II : August 12(Thu) - August 25(Wed), 2021
Period-III : September 9(Thu) - September 24(Fri), 2021


Individual member of cosponsoring academic society can be registered as "Individual member of cosponsoring academic society".

The names of cosponsoring academic societies will be appeared here.

ST-22 [Trans-Division Symposium]
CVD and Dry Process
CVD Society of Japan
Organizing Committee of Cat-CVD Symposium
ST-27 [Trans-Division Symposium]
Multi-scale Expansion of Systems Med & Pharma
ISPE Japan Affiliate
SY-71 [Symposium of Division of Biochemical Engineering]
Accelerating Pharmaceutical/Food Production by Utilization of Advanced Technology in Chemical Process Engineering
Japan Society for Food Engineering
SY-76 [Symposium of Division of Electronics] Electronics Materials and Processes
Kansai Branch, The Japan Institute of Electronics Packaging
Laboratory of flexible and power three dimensional system integration, Osaka University
Kansai area branch of ECSJ
The Surface Finishing Society of Japan
Yokohama Jisso Consortium