Last Update: 2021-09-18 16:09:12
General Information & Schedule
General Information
The Meeting is planning to be an On-site/Virtual hybrid meeting. (Part of the oral sessions use bidirectional live streaming from the on-site venue.) All presentations will be streamed on the internet.
| Date | Sep. 22(Wed) - 24(Fri), 2021 * The session SP-1 will start from Sept. 21. |
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| Venue (on-site) | Tsushima Campus, Okayama Univ. [access] |
| Venue (on-line) | All sessions will be attended from the SCEJ GOING VIRTUAL. (The ID/PW will be sent to the registered participants and invited persons.) |
| Major Programs |
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Banquet
The banquet is cancelled, but an online event (no extra charge) will be held. (Sept. 23 18:20-).
Plenary lecture
The Plenary lecture by Ph.D., Dr.Eng. Martin Green, the 2021 Japan Prize Winner, will be held (Sept. 23. 17:00-18:00).
Schedule
| Application | May 6(Thu) - 11:59 pm of Jun. 15(Tue), 2021 |
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| Preprint Manuscript Submission | July 1(Thu) - 11:59 pm of August 25(Wed), 2021 |
| Preprints OPEN | September 8(Wed), 2021 |
| Poster Submission | July 1(Thu) - 11:59 pm of September 15(Wed), 2021 (Poster presentation only) |
| Registration | Period-I : July 1(Thu) - August 11(Wed), 2021 Period-II : August 12(Thu) - August 25(Wed), 2021 Period-III : September 9(Thu) - September 24(Fri), 2021 |
Co-sponsors
Individual member of cosponsoring academic society can be registered as "Individual member of cosponsoring academic society".
The names of cosponsoring academic societies will be appeared here.
| ST-22 | [Trans-Division Symposium] CVD and Dry Process |
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| CVD Society of Japan Organizing Committee of Cat-CVD Symposium |
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| ST-27 | [Trans-Division Symposium] Multi-scale Expansion of Systems Med & Pharma |
| ISPE Japan Affiliate | |
| SY-71 | [Symposium of Division of Biochemical Engineering] Accelerating Pharmaceutical/Food Production by Utilization of Advanced Technology in Chemical Process Engineering |
| Japan Society for Food Engineering | |
| SY-76 | [Symposium of Division of Electronics] Electronics Materials and Processes |
| Kansai Branch, The Japan Institute of Electronics Packaging Laboratory of flexible and power three dimensional system integration, Osaka University Kansai area branch of ECSJ The Surface Finishing Society of Japan Yokohama Jisso Consortium |