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SCEJ 83rd Annual Meeting (Osaka, 2018)

Last modified: 2018-02-27 10:00:00

Program search result : 12-h : 9 programs

The abstracts can be viewed by clicking the Paper IDs.
The ID/PW printed on the PROGRAM book are required.
(The ID/PW have also been sent to the Early-bird registrees and invited persons by e-mail.)

Topics Code field begins with “12-h”; 9 programs are found.
The search results are sorted by the start time.

TimePaper
ID
Title / AuthorsKeywordsTopic codeAck.
number
Day 1
15:0015:20
O119Shear Thickening Behavior of Concentrated Monodisperse Particle Dispersion
(Toyota Central R&D Lab.) *(Reg)Nakamura Hiroshi, (Cor)Ishii Masahiko
Shear-thickening
Dispersion
Rheology
12-h469
Day 1
15:2015:40
O120LAOS Analysis of Two Model Slurries with Different Shear Thickening Behavior
(Toyota Central R&D Lab.) *(Cor)Ishii Masahiko, (Reg)Nakamura Hiroshi
slurry
shear thickening
Rheology
12-h400
Day 1
15:4016:00
O121Dispersion state of electrode slurry of lithium ion battery and its drying process
LiB
thickness decrease
particle packing
12-h789
Day 1
16:0016:20
O122Modeling of the drying characteristics of colloidal suspensions
Colloidal suspension
Drying rate
Numerical simulation
12-h752
Day 1
16:2016:40
O123Analysis of Cracking in Fuel Cell Catalyst Layers
(Toyota Central R&D Lab.) *(Cor)Higuchi Yuki, (Cor)Kumano Naomi, (Cor)Kudo Kenji, (Cor)Harada Masashi, (Cor)Ishii Masahiko, (Reg)Nakamura Hiroshi
Fuel Cell Catalyst Layers
Cracking
Analysis
12-h626
Day 1
16:4017:00
O124Modification of the film structure of CH3NH3PbI3 deposited by spray deposition
perovskite solar cells
spray deposition
structure
12-h629
Day 2
13:2015:20
PC250Growth rate of a pinhole in a thin liquid film
VOF
Coating
Pinhole
12-h340
Day 2
13:2015:20
PC251Numerical simulation of Curtain coating
Curtain coating
Numerical simulation
OpenFOAM
12-h589
Day 2
13:2015:20
PC252Nanostructure and properties of thermally activated delayed fluorescence organic thin films prepared by coating process
TADF
Organic Electroluminescence
Spin coating
12-h606
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SCEJ 83rd Annual Meeting (Osaka, 2018)


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