I214 - 11. Electronics - Session programs - SCEJ 88th Annual Meeting (Tokyo, 2023)

`SCEJ 88th Annual Meeting (Tokyo, 2023)`

Last modified: 2023-12-13 19:10:32

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Session programs : 11. Electronics : I214

The preprints(abstracts) are now open (Mar. 1st). These can be viewed by clicking the Paper IDs. The ID/PW sent to the Registered participants in Period I/II and invited persons are required.

11. Electronics

Hall I, Day 2

Time	Paper ID	Title / Authors	Keywords	Topic code	Ack. number
Hall I(Lecture Hall Bldg., 3F L0032), Day 2(Mar. 16)
(13:20–14:00) (Chair: Koike Osamu, Tamura Kenji)
13:20– 13:40	I214	Study of filler dispersion and thermal conduction mechanism of thermal grease (Sumitomo Metal Mining) *(Cor)Ogawa Takahiro, (Cor)Kashiwaya Satoshi, (Cor)Ueda Takahiro	thermal grease thermal conduction Interfacial thermal resistance	11-d	20
13:40– 14:00	I215	Investigating the possibility of sintering Cu paste at low temperature -2nd report- (Sumitomo Metal Mining) *(Cor)Hanzawa Kazuki, (Cor)Kashiwaya Satoshi	Sintering Cu paste Necking	11-e	19

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