SY-82 - Session programs - SCEJ 48th Autumn Meeting (Tokushima, 2016)

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`SCEJ 48th Autumn Meeting (Tokushima, 2016)`

Last modified: 2016-09-07 09:49:00

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Session programs : SY-82

The third-day program of ST-12 (Hall D) was partly changed. ST-12 Program (The yellow-backed area is affected.)

SY-82 Symposium of Electronics Division: Materials and Process in Electronics

Organizer:

Kondo Kazuo (Osaka Pref. U,), Orita Nobuaki (Furukawa Electric Co., Ltd.), Takeno Yasuhiko (Global)

Hall N, Day 1

Time	Paper ID	Title / Authors	Keywords	Topic code	Ack. number
Hall N(Bldg.4/5 2F 4-202), Day 1(Sep. 6)
(11:00–11:20) (Chair: Kondo Kazuo)
11:00– 11:20	N107	Detection of cuprous ions by micro ring electrodes on a TSV side wall (Osaka Pref. U.) *(Ful)Hoang Van Ha, (Ful)Kondo Kazuo	Cuprous detection micro electrode TSV	SY-82	588
(11:20–12:00) (Chair: Orita Nobuaki)
11:20– 12:00	N108	[Invited lecture] Progress of the current distribution analysis technology of electrolytic cell (MUSASHI GIKEN LLC.) (Div)Ohara Katsuhiko	electrolytic cell current distribution analysis calculation	SY-82	650
(13:00–13:20) (Chair: Kondo Kazuo)
13:00– 13:20	N113	Fabrication of Fine-pitch Copper Wiring by Micro-contact Printing and Plating Using Nucleating Agent Ink (AIST) *(Div)Tokoro K., Onoue M., Shirakawa N., Ushijima H., (Nissan Chemical Industries) (Cor)Kojima K., (Cor)Chikama K.	printed electronics micro-contact printing electrodeposition	SY-82	101
(13:20–14:20) (Chair: Tokoro Kazuhiko)
13:20– 13:40	N114	NiFe Plating Film for Magnetic Sensor and Magnetic Compass (Tosetz) *(Ful)Miyake Yuko, (Div)Shimizu Sanae, (Div)Matsui Kousuke, (Div)Maruyama Takafumi, (Div)Koizumi Yuichi	NiFe electroplating magnetic sensor	SY-82	926
13:40– 14:00	N115	Advanced analysis of electroplating on patterned wafers (Keisoku Eng. Sys.) *(Cor)Tong Lizhu, (Cor)Nagayama Tatsuhiko, (COMSOL AB) Henrik Ekstrom	Electroplating Patterned wafer Numerical analysis	SY-82	1
14:00– 14:20	N116	High speed Cu electrodeposition in φ12inch-wafer size electrodeposition apparatus (Tosetz) *(Ful)Miyake Yuko, (Div)Koizumi Yuichi, (Div)Matsui Kousuke, (Div)Maruyama Takafumi	High speed Cu plating electrodeposition electrolytic plating apparatus	SY-82	993
(14:40–15:20) (Chair: Orita Nobuaki)
14:40– 15:20	N118	[Invited lecture] The trend of Advance in Semiconductor package technology in IoT era (Grobal Net) (Div)Takeno Yasuhiko	IoT Semiconductor Package 3D	SY-82	776
(15:20–16:40) (Chair: Takeno Yasuhiko)
15:20– 16:00	N120	[Invited lecture] Nano-Structure Controlled Very Low Resistivity Cu Wires By High Purity Plating (Ibaraki U.) *Onuki Jin, Tamahashi Kunihiro, Itou Masahiko, Onuma Shigeharu, Inami Takashi, Namekawa Takashi, Honma Yoshio	Nano-level Cu Wire High Purity Electrolyte Microstructure Analysis	SY-82	679
16:00– 16:40	N122	[Invited lecture] Determination of reaction rate constants of copper electrodeposition on a rotating disk electrode and using for simulation of the cuprous concentration inside TSVs (Osaka Pref. U.) *(Ful)Hoang Van Ha, (Osaka Pref. U..) (Ful)Kondo Kazuo	Copper electrodeposition TSV filling cuprous	SY-82	585

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SCEJ 48th Autumn Meeting (Tokushima, 2016)

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