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SCEJ 48th Autumn Meeting (Tokushima, 2016)

Last modified: 2016-09-07 09:49:00

Session programs : SY-82

The third-day program of ST-12 (Hall D) was partly changed. ST-12 Program (The yellow-backed area is affected.)

SY-82 Symposium of Electronics Division: Materials and Process in Electronics

Organizer: Kondo Kazuo (Osaka Pref. U,), Orita Nobuaki (Furukawa Electric Co., Ltd.), Takeno Yasuhiko (Global)

Hall N, Day 1

TimePaper
ID
Title / AuthorsKeywordsTopic codeAck.
number
Hall N(Bldg.4/5 2F 4-202), Day 1(Sep. 6)
(11:00–11:20) (Chair: Kondo Kazuo)
11:0011:20N107Detection of cuprous ions by micro ring electrodes on a TSV side wall
(Osaka Pref. U.) *(Ful)Hoang Van Ha, (Ful)Kondo Kazuo
Cuprous detection
micro electrode
TSV
SY-82588
(11:20–12:00) (Chair: Orita Nobuaki)
11:2012:00N108[Invited lecture] Progress of the current distribution analysis technology of electrolytic cell
(MUSASHI GIKEN LLC.) (Div)Ohara Katsuhiko
electrolytic cell
current distribution analysis
calculation
SY-82650
(13:00–13:20) (Chair: Kondo Kazuo)
13:0013:20N113Fabrication of Fine-pitch Copper Wiring by Micro-contact Printing and Plating Using Nucleating Agent Ink
(AIST) *(Div)Tokoro K., Onoue M., Shirakawa N., Ushijima H., (Nissan Chemical Industries) (Cor)Kojima K., (Cor)Chikama K.
printed electronics
micro-contact printing
electrodeposition
SY-82101
(13:20–14:20) (Chair: Tokoro Kazuhiko)
13:2013:40N114NiFe Plating Film for Magnetic Sensor and Magnetic Compass
(Tosetz) *(Ful)Miyake Yuko, (Div)Shimizu Sanae, (Div)Matsui Kousuke, (Div)Maruyama Takafumi, (Div)Koizumi Yuichi
NiFe
electroplating
magnetic sensor
SY-82926
13:4014:00N115Advanced analysis of electroplating on patterned wafers
(Keisoku Eng. Sys.) *(Cor)Tong Lizhu, (Cor)Nagayama Tatsuhiko, (COMSOL AB) Henrik Ekstrom
Electroplating
Patterned wafer
Numerical analysis
SY-821
14:0014:20N116High speed Cu electrodeposition in φ12inch-wafer size electrodeposition apparatus
(Tosetz) *(Ful)Miyake Yuko, (Div)Koizumi Yuichi, (Div)Matsui Kousuke, (Div)Maruyama Takafumi
High speed Cu plating
electrodeposition
electrolytic plating apparatus
SY-82993
(14:40–15:20) (Chair: Orita Nobuaki)
14:4015:20N118[Invited lecture] The trend of Advance in Semiconductor package technology in IoT era
(Grobal Net) (Div)Takeno Yasuhiko
IoT
Semiconductor Package
3D
SY-82776
(15:20–16:40) (Chair: Takeno Yasuhiko)
15:2016:00N120[Invited lecture] Nano-Structure Controlled Very Low Resistivity Cu Wires By High Purity Plating
(Ibaraki U.) *Onuki Jin, Tamahashi Kunihiro, Itou Masahiko, Onuma Shigeharu, Inami Takashi, Namekawa Takashi, Honma Yoshio
Nano-level Cu Wire
High Purity Electrolyte
Microstructure Analysis
SY-82679
16:0016:40N122[Invited lecture] Determination of reaction rate constants of copper electrodeposition on a rotating disk electrode and using for simulation of the cuprous concentration inside TSVs
(Osaka Pref. U.) *(Ful)Hoang Van Ha, (Osaka Pref. U..) (Ful)Kondo Kazuo
Copper electrodeposition
TSV filling
cuprous
SY-82585

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SCEJ 48th Autumn Meeting (Tokushima, 2016)


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