Last modified: 2023-05-16 19:47:30
CVD and other dry processes are core technology in the industry applications for solar cell, electronics devices, MEMS, and functional coatings. This symposium motivates to discuss the logical optimization and design for controlling the microstructure and functions of thin films and fine particles produced by CVD or other dry processes based on the theoretical understanding of reaction mechanisms. Young Researcher Award will be given to distinguished young speakers chosen at the session.
Time | Paper ID | Title / Authors | Keywords | Topic code | Ack. number |
---|---|---|---|---|---|
Hall K, Day 2 | |||||
(9:20–10:20) (Chair: | |||||
K202 | Effects of dispersant for PECVD process with concurrent use of solid raw material upon synthesized composite thin films | titanium dioxide carbon nanotube photocatalyst | ST-22 | 213 | |
K203 | Preparation of nanostructured particles using direct spray type tubular flames | Nanostructured particle Flame spray pyrolysis Tubular flame | ST-22 | 55 | |
K204 | Synthesis of metal particles by tubular flames | Metal particles Flame spray pyrolysis Tubular flame | ST-22 | 174 | |
Break | |||||
(10:40–12:00) (Chair: | |||||
K206 | Effects of the central metals of perovskite thin film on structure | CVD perovskite central metals | ST-22 | 414 | |
K207 | Highly-loaded Ni on CeO2 prepared by flame spray pyrolysis | Ni CeO2 Flame spray pyrolysis | ST-22 | 686 | |
K208 | [Review lecture] Future Prospects of Plasma Deposition Technology | plasma enhanced deposition plasma equipment design reactive species control | ST-22 | 110 | |
(13:00–14:20) (Chair: | |||||
K213 | [Invited lecture] A new HVPE growth technique which brings high quality GaN substrates; maskless-3D | GaN substrate, HVPE low dislocation density | ST-22 | 112 | |
K214 | Effect of SiCl4 addition for SiC-CVD from MTS/H2 | CVD SiC Recycle | ST-22 | 556 | |
K215 | Manufacture of SiCf/SiC by chlorine-free Chemical Vapor Infiltration | SiC chemical vapor infiltration tetramethylsilane | ST-22 | 822 | |
K216 | Production and Characterization of Organic Thin Films by Rapid Expansion of Supercritical Solutions (RESS) Using CO2 | RESS Organic thin films Supercritical CO2 | ST-22 | 781 | |
(14:20–15:20) (Chair: | |||||
K217 | Kinetic analysis of TiAlN-CVD process for construction of reaction model (2) | CVD TiAlN cutting tool | ST-22 | 153 | |
K218 | Synthesis of AlOx thin films by mist-CVD for electrical insulator layer of FETs | mist-CVD AlOx | ST-22 | 306 | |
K219 | Fabrication of SiO2 and Al2O3 insulator film by mist chemical vapor deposition | insulator thin-film-transistor mist chemical vapor deposition | ST-22 | 135 | |
Hall K, Day 3 | |||||
(9:00–10:20) (Chair: | |||||
K301 | Continuous synthesis of carbon nanoparticle-nanotube composite by high-temperature pyrolysis of acetylene | Carbon nanoparticle Carbon nanotube CVD | ST-22 | 175 | |
K302 | Fabrication and hierarchical structure control of carbon nanotube electron field emitter for X-ray tube | carbon nanotube electron field emitter hierarchical structure control | ST-22 | 230 | |
K303 | ZnO coating of carbon nanotubes by in-flight PECVD method | plasma-enhanced chemical vapor deposition nanocoating aerosol | ST-22 | 310 | |
K304 | QCM for evaluating gas flow in Minimal-CVD reactor | CVD QCM Minimal | ST-22 | 62 | |
Break | |||||
(10:40–12:00) (Chair: | |||||
K306 | Reaction mechanism analysis of polycrystalline SiC-CVD for high-speed, uniform growth process design | Reaction model SiC CVD | ST-22 | 499 | |
K307 | Time-evolution of film thickness profiles by level set method during CVD multiscale simulation | multiscale simulation chemical vapor deposition level set method | ST-22 | 504 | |
K308 | [Review lecture] Concept, design and future of semi-batch type ALD equipment and process | ALD Equipment Semi-Batch | ST-22 | 111 | |
(13:00–14:20) (Chair: | |||||
K313 | [Invited lecture] Characterization of silicon and nitrogen doped diamond-like carbon thin films prepared by plasma-enhanced chemical vapor deposition | diamond-like carbon plasma-enhanced chemical vapor deposition silicon | ST-22 | 248 | |
K314 | Residual stress in gas barrier silica film prepared by plasma chemical vapor deposition | CVD Residual stress Silica gas barrier film | ST-22 | 13 | |
K315 | Theoretical study for modeling surface reactions on SiC-CVI process | CH3SiCl3 SiC CVI surface reaction | ST-22 | 665 | |
K316 | Construction of surface reaction mechanism of SiC-CVI based on theoretical study | SiC-CVI Surface reaction mechanism CH3SiCl3 | ST-22 | 682 |
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SCEJ 51st Autumn Meeting (2020)